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Intel CPU Microarchitecture

http://en.wikipedia.org/wiki/Intel_Tick_Tock

Atom Roadmap^[16]
	Fabrication process	Microarchitecture	Release date	Processors/SoCs
	Fabrication process	Microarchitecture	Release date	MID, Smartphone	Tablet	Nettop, netbook	Embedded	Server	CE
	45 nm	Bonnell	2008	Silverthorne	N/A	Diamondville	Tunnel Creek	N/A	Sodaville
	45 nm		2010	Lincroft		Pineview	Tunnel Creek	N/A	Groveland
	32 nm		2011	Penwell		Cedarview	?	Centerton	Berryville
	32 nm		2012	Cloverview		Cedarview	?	Centerton	Berryville
	22 nm	Silvermont	2013	Tangier^[17]	Valleyview	Unknown	Rangeley	Avoton	Unknown
Tick	14 nm^[16]	Silvermont	2014	Anniedale^{[citation needed]}	Cherryview^[18]	Unknown	Unknown	Denverton	Unknown
Tock	14 nm^[16]	Goldmont^[19]^[20]	2015	Broxton^[21]		Unknown	Unknown	Unknown	Unknown

NetBurst

⏎

⏎

Core

Nehalem

Sandy Bridge

Haswell

Skylake

Bonnell

Silvermont

Goldmont

Goldmont

http://en.wikipedia.org/wiki/Core_(microarchitecture)

Intel Core (microarchitecture)

From Wikipedia, the free encyclopedia

(Redirected from Core (microarchitecture))

This article is about the Intel microarchitecture. For Intel processors branded as Intel Core, see Intel Core.

Intel Core

L1 cache	64 kB per core
L2 cache	1 MB to 8 MB unified
L3 cache	8 MB to 16 MB shared (Xeon)
Predecessor	Enhanced Pentium M
Successor	Penryn (tick) Nehalem (tock)
Socket(s)	Socket M (µPGA 478) Socket P (µPGA 478) Socket T (LGA 775) FCBGA (µBGA 479) FCBGA (µBGA 965)

The Intel Core microarchitecture (previously known as the Next-Generation Micro-Architecture) is a multi-core processor microarchitecture unveiled by Intelin Q1 2006. It is based on the Yonah processor design and can be considered an iteration of the P6 microarchitecture, introduced in 1995 with Pentium Pro. The high power consumption and heat intensity, the resulting inability to effectively increase clock speed, and other shortcomings such as the inefficient pipeline were the primary reasons for which Intel abandoned the NetBurst microarchitecture and switched to completely different architectural design, delivering high efficiency through a small pipeline rather than high clock speeds. It is worth noting that the Core microarchitecture never reached the clock speeds of the Netburst microarchitecture, even after moving to the 45 nm lithography.

The first processors that used this architecture were code-named Merom, Conroe, and Woodcrest; Merom is for mobile computing, Conroe is for desktop systems, and Woodcrest is for servers and workstations. While architecturally identical, the three processor lines differ in the socket used, bus speed, and power consumption. Mainstream Core-based processors are branded Pentium Dual-Core or Pentium and low end branded Celeron; server and workstation Core-based processors are branded Xeon, while desktop and mobile Core-based processors are branded as Core 2. Despite their names, processors sold as Core Solo/Core Duo and Core i3/i5/i7 do not actually use the Core microarchitecture and are based on the Enhanced Pentium M and newer Nehalem/Sandy Bridge/Haswellmicroarchitectures, respectively.

Features[edit]

The Core microarchitecture returned to lower clock rates and improved the usage of both available clock cycles and power when compared with the preceding NetBurst microarchitecture of the Pentium 4/D-branded CPUs.^[1] The Core microarchitecture provides more efficient decoding stages, execution units, caches, and buses, reducing the power consumption of Core 2-branded CPUs while increasing their processing capacity. Intel's CPUs have varied widely in power consumption according to clock rate, architecture, and semiconductor process, shown in the CPU power dissipation tables.

Like the last NetBurst CPUs, Core based processors feature multiple cores and hardware virtualization support (marketed as Intel VT-x), as well as Intel 64 and SSSE3. However, Core-based processors do not have the Hyper-Threading Technology found in Pentium 4 processors. This is because the Core microarchitecture is a descendant of the P6 microarchitecture used by Pentium Pro, Pentium II, Pentium III, and Pentium M.

The L1 cache size was enlarged in the Core microarchitecture, from 32KB on Pentium II/III (16 KB L1 Data + 16 KB L1 Instruction) to 64 KB L1 cache/core (32 KB L1 Data + 32 KB L1 Instruction) on Pentium M and Core/Core 2. It also lacks an L3 Cache found in the Gallatin core of the Pentium 4 Extreme Edition, although an L3 Cache is present in high-end versions of Core-based Xeons. Both an L3 cache and Hyper-threading were reintroduced in the Nehalem microarchitecture.

Roadmap[edit]

Main article: Intel Tick-Tock

Intel CPU core roadmaps from NetBurst and P6 to Cannonlake

Technology[edit]

While the Core microarchitecture is a major architectural revision it is based in part on the Pentium M processor family designed by Intel Israel.^[2] The Penryn pipeline is 12–14 stages long^[3] — less than half of Prescott's, a signature feature of wide order execution cores. Penryn's successor, Nehalem has 16 pipeline stages.^[3] Core's execution unit is 4 issues wide, compared to the 3-issue cores of P6, Pentium M, and 2-issue cores of NetBurst microarchitectures. The new architecture is a dual core design with linked L1 cache and shared L2 cache engineered for maximum performance per watt and improved scalability.

One new technology included in the design is Macro-Ops Fusion, which combines two x86 instructions into a single micro-operation. For example, a common code sequence like a compare followed by a conditional jump would become a single micro-op.

Other new technologies include 1 cycle throughput (2 cycles previously) of all 128-bit SSE instructions and a new power saving design. All components will run at minimum speed, ramping up speed dynamically as needed (similar to AMD's Cool'n'Quiet power-saving technology, as well as Intel's own SpeedStep technology from earlier mobile processors). This allows the chip to produce less heat, and consume as little power as possible.

Intel Core microarchitecture.

For most Woodcrest CPUs, the front side bus (FSB) runs at 1333 MT/s; however, this is scaled down to 1066 MT/s for lower end 1.60 and 1.86 GHz variants.^[4]^[5] The Merom mobile variant was initially targeted to run at a FSB of 667 MT/s while the second wave of Meroms, supporting 800 MT/s FSB, were released as part of the Santa Rosa platform with a different socket in May 2007. The desktop-oriented Conroe began with models having an FSB of 800 MT/s or 1066 MT/s with a 1333 MT/s line officially launched on July 22, 2007.

The power consumption of these new processors is extremely low—average use energy consumption is to be in the 1–2 watt range in ultra low voltage variants, withthermal design powers (TDPs) of 65 watts for Conroe and most Woodcrests, 80 watts for the 3.0 GHz Woodcrest, and 40 watts for the low-voltage Woodcrest. In comparison, an AMD Opteron 875HE processor consumes 55 watts, while the energy efficient Socket AM2 line fits in the 35 watt thermal envelope (specified a different way so not directly comparable). Merom, the mobile variant, is listed at 35 watts TDP for standard versions and 5 watts TDP for Ultra Low Voltage (ULV) versions.^{[citation needed]}

Previously, Intel announced that it would now focus on power efficiency, rather than raw performance. However, at IDF in the spring of 2006, Intel advertised both. Some of the promised numbers were:

20% more performance for Merom at the same power level (compared to Core Duo)
40% more performance for Conroe at 40% less power (compared to Pentium D)
80% more performance for Woodcrest at 35% less power (compared to the original dual-core Xeon)

Processor cores[edit]

The processors of the Core microarchitecture can be categorized by number of cores, cache size, and socket; each combination of these has a unique code name and product code that is used across a number of brands. For instance, code name "Allendale" with product code 80557 has two cores, 2 MB L2 cache and uses the desktop socket 775, but has been marketed as Celeron, Pentium, Core 2 and Xeon, each with different sets of features enabled. Most of the mobile and desktop processors come in two variants that differ in the size of the L2 cache, but the specific amount of L2 cache in a product can also be reduced by disabling parts at production time. Wolfdale-DP and all quad-core processors except Dunnington QC are multi-chip modules combining two dies. For the 65 nm processors, the same product code can be shared by processors with different dies, but the specific information about which one is used can be derived from the stepping.

	fab	cores	Mobile		Desktop, UP Server		CL Server	DP Server	MP Server
Single-Core 65 nm	65 nm	1	Merom-L 80537		Conroe-L 80557
Single-Core 45 nm	45 nm	1		Penryn-L 80585				Wolfdale-CL 80588
Dual-Core 65 nm	65 nm	2	Merom-2M 80537	Merom 80537	Allendale 80557	Conroe 80557	Conroe-CL 80556	Woodcrest 80556	Tigerton-DC 80564
Dual-Core 45 nm	45 nm	2	Penryn-3M 80577	Penryn 80576	Wolfdale-3M 80571	Wolfdale 80570	Wolfdale-CL 80588	Wolfdale-DP 80573
Quad-Core 65 nm	65 nm	4				Kentsfield 80562		Clovertown 80563	Tigerton 80565
Quad-Core 45 nm	45 nm	4		Penryn-QC 80581	Yorkfield-6M 80580	Yorkfield 80569	Yorkfield-CL 80584	Harpertown 80574	Dunnington QC 80583
Six-Core 45 nm	45 nm	6							Dunnington 80582

Conroe/Merom (65 nm)[edit]

Main article: Conroe (microprocessor)

The original Core 2 processors are based around the same dies that can be identified as CPUID Family 6 Model 15. Depending on their configuration and packaging, their code names are Conroe (LGA 775, 4 MB L2 cache), Allendale (LGA 775, 2 MB L2 cache), Merom (Socket M, 4 MB L2 cache) and Kentsfield (Multi-chip module, LGA 775, 2x4MB L2 cache). Merom and Allendale processors with limited features can be found in Pentium Dual Core and Celeron processors, while Conroe, Allendale and Kentsfield also are sold as Xeon processors.

Additional code names for processors based on this model are Woodcrest (LGA 771, 4 MB L2 cache), Clovertown (MCM, LGA 771, 2×4MB L2 cache) and Tigerton (MCM, Socket 604, 2×4MB L2 cache), all of which are marketed only under the Xeon brand.

Processor	Brand name	Model (list)	Cores	L2 Cache	Socket	TDP
Merom-2M	Mobile Core 2 Duo	U7xxx	2	2 MiB	BGA479	10 W
Merom		L7xxx		4 MiB	BGA479	17 W
Merom Merom-2M		T5xxx T7xxx		2–4 MiB	Socket M Socket P BGA479	35 W
Merom	Mobile Core 2 Extreme	X7xxx	2	4 MiB	Socket P	44 W
Merom	Celeron M	5x0	1	512 KiB	Socket M Socket P	30 W
Merom-2M	Celeron M	5x5	1	Socket P	Socket M Socket P	31 W
Merom-2M	Celeron Dual-Core	T1xxx	2	512–1024 KiB	Socket P	35 W
Merom-2M	Pentium Dual-Core	T2xxx T3xxx	2	1 MiB	Socket P	35 W
Allendale	Xeon	3xxx	2	2 MB	LGA 775	65 W
Conroe	Xeon	3xxx	2	2–4 MB	LGA 775	65 W
Conroe and Allendale	Core 2 Duo	E4xxx	2	2 MB	LGA 775	65 W
Conroe and Allendale		E6xx0		2–4 MB	LGA 775
Conroe-CL		E6xx5		2–4 MB	LGA 771
Conroe-XE	Core 2 Extreme	X6xxx	2	4 MB	LGA 775	75 W
Allendale	Pentium Dual-Core	E2xxx	2	1 MB	LGA 775	65 W
Allendale	Celeron	E1xxx	2	512 kB	LGA 775	65 W
Kentsfield	Xeon	32xx	4	2×4 MiB	LGA 775	95–105 W
Kentsfield	Core 2 Quad	Q6xxx	4	2×4 MiB	LGA 775	95–105 W
Kentsfield XE	Core 2 Extreme	QX6xxx	4	2×4 MiB	LGA 775	130 W
Woodcrest	Xeon	51xx	2	4 MB	LGA 771	65–80 W
Clovertown		L53xx	4	2×4 MB	LGA 771	40–50 W
		E53xx				80 W
		X53xx				120–150 W
Tigerton-DC		E72xx	2	2×4 MB	Socket 604	80 W
Tigerton		L73xx	4	2×4 MB		50 W
		E73xx		2×2–2×4 MB		80 W
		X73xx		2×4 MB		130 W

Conroe-L/Merom-L[edit]

The Conroe-L and Merom-L processors are based around the same core as Conroe and Merom, but only contain a single core and 1 MB of L2 cache, significantly reducing production cost and power consumption of the processor at the expense of performance compared to the dual-core version. It is used only in ultra-low voltage Core 2 Solo U2xxx and in Celeron processors and is identified as CPUID family 6 model 22.

Processor	Brand name	Model (list)	Cores	L2 Cache	Socket	TDP
Merom-L	Mobile Core 2 Solo	U2xxx	1	2 MiB	BGA479	5.5 W
Merom-L	Celeron M	5x0	1	512 KiB	Socket M Socket P	27 W
Merom-L	Celeron M	5x3	1	512–1024 KiB	BGA479	5.5–10 W
Conroe-L	Celeron M	4x0	1	512 KiB	LGA 775	35 W
Conroe-CL	Celeron M	4x5	1	512 KiB	LGA 771	65 W

Penryn/Wolfdale (45 nm)[edit]

Main article: Penryn (microarchitecture)

In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23. In Core 2 processors, it is used with the code names Penryn (Socket P), Wolfdale (LGA 775) and Yorkfield (MCM, LGA 775), some of which are also sold as Celeron, Pentium and Xeon processors. In the Xeon brand, the Wolfdale-DP and Harpertown code names are used for LGA 771 based MCMs with two or four active Wolfdale cores.

The chips come in two sizes, with 6 MB and 3 MB L2 cache. The smaller version is commonly called Penryn-3M and Wolfdale-3M as well as Yorkfield-6M, respectively. The single-core version of Penryn, listed as Penryn-L here, is not a separate model like Merom-L but a version of the Penryn-3M model with only one active core.

Processor	Brand name	Model (list)	Cores	L2 Cache	Socket	TDP
Penryn-L	Core 2 Solo	SU3xxx	1	3 MiB	BGA956	5.5 W
Penryn-3M	Core 2 Duo	SU7xxx	2	3 MB	BGA956	10 W
Penryn-3M		SU9xxx		3 MB		10 W
Penryn		SL9xxx		6 MiB		17 W
Penryn		SP9xxx		6 MiB		25/28 W
Penryn-3M		P7xxx		3 MiB	Socket P FCBGA6	25 W
Penryn-3M		P8xxx		3 MiB
Penryn		P9xxx		6 MiB
Penryn-3M		T6xxx		2 MiB		35 W
Penryn-3M		T8xxx		3 MiB
Penryn		T9xxx		6 MiB
Penryn		E8x35		6 MiB	Socket P	35-55 W
Penryn-QC	Core 2 Quad	Q9xxx	4	2x3-2x6 MiB	Socket P	45 W
Penryn XE	Core 2 Extreme	X9xxx	2	6 MiB	Socket P	44 W
Penryn-QC	Core 2 Extreme	QX9xxx	4	2x6 MiB	Socket P	45 W
Penryn-3M	Celeron	T3xxx	2	1 MiB	Socket P	35 W
Penryn-3M		SU2xxx	2	1 MiB	µFC-BGA 956	10 W
Penryn-L		9x0	1	1 MiB	Socket P	35 W
Penryn-L		7x3	1	1 MiB	µFC-BGA 956	10 W
Penryn-3M	Pentium	T4xxx	2	1 MiB	Socket P	35 W
Penryn-3M		SU4xxx	2	2 MiB	µFC-BGA 956	10 W
Penryn-L		SU2xxx	1	2 MiB	µFC-BGA 956	5.5 W
Wolfdale-3M
	Celeron	E3xxx	2	1 MB	LGA 775	65 W
	Pentium	E2210		1 MB
		E5xxx		2 MB
		E6xxx		2 MB
	Core 2 Duo	E7xxx		3 MB
Wolfdale	Core 2 Duo	E8xxx		6 MB
Wolfdale	Xeon	31x0				45-65 W
Wolfdale-CL		30x4	1		LGA 771	30 W
Wolfdale-CL		31x3	2		LGA 771	65 W
Yorkfield	Xeon	X33x0	4	2×3–2×6 MB	LGA 775	65–95 W
Yorkfield-CL	Xeon	X33x3		2×3–2×6 MB	LGA 771	80 W
Yorkfield-6M	Core 2 Quad	Q8xxx		2×2 MB	LGA 775	65–95 W
Yorkfield-6M		Q9x0x		2×3 MB
Yorkfield		Q9x5x		2×6 MB
Yorkfield XE	Core 2 Extreme	QX9xxx		2×6 MB		130–136 W
Yorkfield XE	Core 2 Extreme	QX9xx5		2×6 MB	LGA 771	150 W
Wolfdale-DP	Xeon	E52xx	2	6 MB	LGA 771	65 W
		L52xx				20-55 W
		X52xx				80 W
Harpertown		E54xx	4	2×6 MB	LGA 771	80 W
		L54xx				40-50 W
		X54xx				120-150 W

Dunnington[edit]

The Xeon "Dunnington" processor (CPUID Family 6, model 30) is closely related to Wolfdale but comes with six cores and an on-chip L3 cache and is designed for servers with Socket 604, so it is marketed only as Xeon, not as Core 2.

Processor	Brand name	Model (list)	Cores	L3 Cache	Socket	TDP
Dunnington	Xeon	E74xx	4-6	8-16 MB	Socket 604	90 W
		L74xx	4-6	12 MB		50-65 W
		X7460	6	16 MB		130 W

Steppings[edit]

The Core microarchitecture uses a number of steppings, which unlike previous microarchitectures not only represent incremental improvements but also different sets of features like cache size and low power modes. Most of these steppings are used across brands, typically by disabling some of the features and limiting clock frequencies on low-end chips.

Steppings with a reduced cache size use a separate naming scheme, which means that the releases are no longer in alphabetic order. Additional steppings have been used in internal and engineering samples, but are not listed in the tables.

Many of the high-end Core 2 and Xeon processors use Multi-Chip Modules of two or three chips in order to get larger cache sizes or more than two cores.

Steppings using 65 nm process[edit]

Stepping	Released	Area	CPUID	L2 cache	Max. clock	Celeron	Pentium	Core 2	Celeron	Pentium	Core 2	Xeon	Core 2	Xeon	Xeon
						Mobile (Merom)			Desktop (Conroe)				Desktop (Kentsfield)		Server (Woodcrest, Clovertown,Tigerton)
B2	Jul 2006	143 mm²	06F6	4 MiB	2.93 GHz	M5xx		T5000 T7000 L7000			E6000 X6000	3000			5100
B3	Nov 2006	143 mm²	06F7	4 MiB	3.00 GHz								Q6000 QX6000	3200	5300
L2	Jan 2007	111 mm²	06F2	2 MiB	2.13 GHz			T5000 U7000		E2000	E4000 E6000	3000
E1	May 2007	143 mm²	06FA	4 MiB	2.80 GHz	M5xx		T7000 L7000 X7000
G0	Apr 2007	143 mm²	06FB	4 MiB	3.00 GHz	M5xx		T7000 L7000 X7000		E2000	E4000 E6000	3000	Q6000 QX6000	3200	5100 5300 7200 7300
G2	Mar 2009	143 mm²	06FB	4 MiB	2.16 GHz	M5xx		T5000 T7000 L7000
M0	Jul 2007	111 mm²	06FD	2 MiB	2.40 GHz	5xx T1000	T2000 T3000	T5000 T7000 U7000	E1000	E2000	E4000
A1	Jun 2007	81 mm²	10661	1 MiB	2.20 GHz	M5xx		U2000	220 4x0

Steppings B2/B3, E1 and G0 of model 15 (cpuid 06fx) processors are evolutionary steps of the standard Merom/Conroe die with 4 MiB L2 cache, with the short-lived E1 stepping only being used in mobile processors. Stepping L2 and M0 are the "Allendale" chips with just 2 MiB L2 cache, reducing production cost and power consumption for low-end processors.

The G0 and M0 steppings improve idle power consumption in C1E state and add the C2E state in desktop processors. In mobile processors, all of which support C1 through C4 idle states, steppings E1, G0, and M0 add support for the Mobile Intel 965 Express (Santa Rosa) platform with Socket P, while the earlier B2 and L2 steppings only appear for the Socket M based Mobile Intel 945 Express (Napa refresh) platform.

The model 22 stepping A1 (cpuid 10661h) marks a significant design change, with just a single core and 1 MiB L2 cache further reducing the power consumption and manufacturing cost for the low-end. Like the earlier steppings, A1 is not used with the Mobile Intel 965 Express platform.

Steppings G0, M0 and A1 mostly replaced all older steppings in 2008. In 2009, a new stepping G2 was introduced to replace the original stepping B2.^[6]

Steppings using 45 nm process[edit]

Stepping	Released	Area	CPUID	L2 cache	Max. clock	Celeron	Pentium	Core 2	Celeron	Pentium	Core 2	Xeon	Core 2	Xeon	Xeon
						Mobile (Penryn)			Desktop (Wolfdale)				Desktop (Yorkfield)		Server (Wolfdale-DP, Harpertown,Dunnington)
C0	Nov 2007	107 mm²	10676	6 MiB	3.00 GHz			E8000 P7000 T8000 T9000 P9000 SP9000 SL9000 X9000			E8000	3100	QX9000		5200 5400
M0	Mar 2008	82 mm²	10676	3 MiB	2.40 GHz	7xx		SU3000 P7000 P8000 T8000 SU9000		E5000 E2000	E7000
C1	Mar 2008	107 mm²	10677	6 MiB	3.20 GHz								Q9000 QX9000	3300
M1	Mar 2008	82 mm²	10677	3 MiB	2.50 GHz								Q8000 Q9000	3300
E0	Aug 2008	107 mm²	1067A	6 MiB	3.33 GHz			T9000 P9000 SP9000 SL9000 Q9000 QX9000			E8000	3100	Q9000 Q9000S QX9000	3300	5200 5400
R0	Aug 2008	82 mm²	1067A	3 MiB	2.93 GHz	7xx 900 SU2000 T3000	T4000 SU2000 SU4000	SU3000 T6000 SU7000 P8000 SU9000	E3000	E5000 E6000	E7000		Q8000 Q8000S Q9000 Q9000S	3300
A1	Sep 2008	503 mm²	106D1	3 MiB	2.67 GHz										7400

In the model 23 (cpuid 01067xh), Intel started marketing stepping with full (6 MiB) and reduced (3 MiB) L2 cache at the same time, and giving them identical cpuid values. All steppings have the new SSE4.1instructions. Stepping C1/M1 was a bug fix version of C0/M0 specifically for quad core processors and only used in those. Stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and replaces all earlier steppings.

In mobile processors, stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform, whereas stepping E0/R0 supports the later Intel Mobile 4 Express (Montevina) platform.

Model 30 stepping A1 (cpuid 106d1h) adds an L3 cache as well as six instead of the usual two cores, which leads to an unusually large die size of 503 mm².^[7] As of February 2008, it has only found its way into the very high-end Xeon 7400 series (Dunnington).

System requirements[edit]

Motherboard compatibility[edit]

Conroe, Conroe XE and Allendale all use Socket LGA 775; however, not every motherboard is compatible with these processors.

Supporting chipsets are:

Intel: 865G/PE/P, 945G/GZ/GC/P/PL, 965G/P, 975X, P/G/Q965, Q963, 946GZ/PL, P3x, G3x, Q3x, X38, X48, P4x, 5400 Express, Intel G31, G33 Chipsets
NVIDIA: nForce4 Ultra/SLI X16 for Intel, nForce 570/590 SLI for Intel, nForce 650i Ultra/650i SLI/680i LT SLI/680i SLI and nForce 750i SLI/780i SLI/790i SLI/790i Ultra SLI.
VIA: P4M800, P4M800PRO, P4M890, P4M900, PT880 Pro/Ultra, PT890.
SiS: 662, 671, 671fx, 672, 672fx
ATI: Radeon Xpress 200 and CrossFire Xpress 3200 for Intel

See also: List of Intel chipsets

The currently released Yorkfield XE model QX9770 (45 nm with 1600FSB) currently has limited chipset compatibility - with only X38, P35 (With Overclocking) and some high-performance X48 and P45 motherboards being compatible. BIOS updates are gradually being released to provide support for the new Penryn technology, and the new QX9775 is only compatible with D5400XS. The Wolfdale-3M model E7200 also has limited compatibility (at least the Xpress 200 chipset is incompatible)^{[citation needed]}.

Although a motherboard may have the required chipset to support Conroe, some motherboards based on the above mentioned chipsets do not support Conroe. This is because all Conroe-based processors require a new power delivery feature set specified in Voltage Regulator-Down (VRD) 11.0. This requirement is a result of Conroe's significantly lower power consumption, compared to the Pentium 4/D CPUs it is replacing. A motherboard that has both a supporting chipset and VRD 11 supports Conroe processors, but even then some boards will need an updated BIOS to recognize Conroe's FID (Frequency ID) and VID (Voltage ID).

Synchronous memory modules[edit]

Unlike the previous Pentium 4 and Pentium D design, the Core 2 technology sees a greater benefit from memory running synchronously with the Front Side Bus (FSB). This means that for the Conroe CPUs with FSB of 1066 MT/s, the ideal memory performance for DDR2 is PC2-8500. In a few configurations, using PC2-5300 instead of PC2-4200 can actually decrease performance. Only when going to PC2-6400is there a significant performance increase. While DDR2 memory models with tighter timing specifications do improve performance, the difference in real world games and applications is often negligible.^[8]

Optimally, the memory bandwidth afforded should match the bandwidth of the FSB, that is to say that a CPU with a 533 MT/s rated bus speed should be paired with RAM matching the same rated speed, for example DDR2 533, or PC2-4200. A common myth^{[citation needed]} is that installing interleaved RAM will offer double the bandwidth. However, at most the increase in bandwidth by installing interleaved RAM is roughly 5–10%. The AGTL+ PSB^{[dead link]} used by all NetBurst processors as well as current and medium-term (pre-QuickPath) Core 2 processors provide a 64-bit data path. Current chipsets provide for a couple of either DDR2 or DDR3 channels.

Matched processor and RAM ratings
Processor model	Front side bus	Matched memory and maximum bandwidth single channel / dual channel
Processor model	Front side bus	DDR	DDR2	DDR3
mobile: T5200, T5300, U2n00, U7n00	533 MT/s	PC-3200 (DDR-400) 3.2 GB/s	PC2-4200 (DDR2-533) 4.264 GB/s PC2-8500 (DDR2-1066) 8.532 GB/s	PC3-8500 (DDR3-1066) 8.530 GB/s
desktop: E6n00, E6n20, X6n00, E7n00, Q6n00 and QX6n00 mobile: T9400, T9550, T9600, P7350, P7450, P8400, P8600, P8700, P9500, P9600, SP9300, SP9400, X9100	1066 MT/s	PC-3200 (DDR-400) 3.2 GB/s		PC3-8500 (DDR3-1066) 8.530 GB/s
mobile: T5n00, T5n50, T7n00 (Socket M), L7200, L7400	667 MT/s	PC-3200 (DDR-400) 3.2 GB/s	PC2-5300 (DDR2-667) 5.336 GB/s	PC3-10600 (DDR3-1333) 10.670 GB/s
desktop: E6n40, E6n50, E8nn0, Q9nn0, QX6n50, QX9650	1333 MT/s	PC-3200 (DDR-400) 3.2 GB/s	PC2-5300 (DDR2-667) 5.336 GB/s	PC3-10600 (DDR3-1333) 10.670 GB/s
mobile: T5n70, T6400, T7n00 (Socket P), L7300, L7500, X7n00, T8n00, T9300, T9500, X9000 desktop: E4n00, Pentium E2nn0, Pentium E5nn0, Celeron 4n0, E3n00	800 MT/s	PC-3200 (DDR-400) 3.2 GB/s PC-3200 (DDR-400) 3.2 GB/s	PC2-6400 (DDR2-800) 6.400 GB/s PC2-8500 (DDR2-1066) 8.532 GB/s	PC3-6400 (DDR3-800) 6.400 GB/s PC3-12800 (DDR3-1600) 12.800 GB/s
desktop: QX9770, QX9775	1600 MT/s	PC-3200 (DDR-400) 3.2 GB/s PC-3200 (DDR-400) 3.2 GB/s

On jobs requiring large amounts of memory access, the quad-core Core 2 processors can benefit significantly^[9] from using a PC2-8500 memory, which runs exactly the same speed as the CPU's FSB; this is not an officially supported configuration, but a number of motherboards offer it.

The Core 2 processor does not require the use of DDR2. While the Intel 975X and P965 chipsets require this memory, some motherboards and chipsets support both the Core 2 and DDR memory. When using DDR memory, performance may be reduced because of the lower available memory bandwidth.

Chip errata[edit]

The Core 2 memory management unit (MMU) in X6800, E6000 and E4000 processors does not operate to previous specifications implemented in previous generations of x86 hardware. This may cause problems, many of them serious security and stability issues, with existing operating system software. Intel's documentation states that their programming manuals will be updated "in the coming months" with information on recommended methods of managing the translation lookaside buffer (TLB) for Core 2 to avoid issues, and admits that, "in rare instances, improper TLB invalidation may result in unpredictable system behavior, such as hangs or incorrect data."^[10]

Among the issues noted:

Non-execute bit is shared across the cores.
Floating point instruction non-coherencies.
Allowed memory corruptions outside of the range of permitted writing for a process by running common instruction sequences.

Intel errata Ax39, Ax43, Ax65, Ax79, Ax90, Ax99 are said to be particularly serious.^[11] 39, 43, 79, which can cause unpredictable behavior or system hang, have been fixed in recent steppings.

Among those who have noted the errata to be particularly serious are OpenBSD's Theo de Raadt^[12] and DragonFly BSD's Matthew Dillon.^[13] Taking a contrasting view was Linus Torvalds, calling the TLB issue "totally insignificant", adding, "The biggest problem is that Intel should just have documented the TLB behavior better."^[14]

Microsoft has issued update KB936357 to address the errata by microcode update,^[15] with no performance penalty. BIOS updates are also available to fix the issue.

Key Terms[edit]

MT/s. Millions of transfers/second, each transfer on the Intel Core architecture is 32-bits.

Penryn (microarchitecture)

From Wikipedia, the free encyclopedia

Penryn

L1 cache	64 KB per core
L2 cache	3 MB to 12 MB unified
L3 cache	8 MB to 16 MB shared (Xeon)
Predecessor	Core
Successor	Nehalem
Socket(s)	Socket M (µPGA 478) Socket P (µPGA 478) Socket T (LGA 775) FCBGA (µBGA 479) FCBGA (µBGA 965)

In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23. In Core 2 processors, it is used with the code names Penryn (Socket P), Wolfdale (LGA 775) and Yorkfield (MCM, LGA 775), some of which are also sold as Celeron, Pentium and Xeon processors. In the Xeon brand, the Wolfdale-DP and Harpertown code names are used for LGA 771 based MCMs with two or four active Wolfdale cores.

[hide]

CPU List[edit]

Processor	Brand name	Model (list)	Cores	L2 Cache	Socket	TDP
Penryn-L	Core 2 Solo	SU3xxx	1	3 MiB	BGA956	5.5 W
Penryn-3M	Core 2 Duo	SU7xxx	2	3 MB	BGA956	10 W
Penryn-3M		SU9xxx		3 MB		10 W
Penryn		SL9xxx		6 MiB		17 W
Penryn		SP9xxx		6 MiB		25/28 W
Penryn-3M		P7xxx		3 MiB	Socket P FCBGA6	25 W
Penryn-3M		P8xxx		3 MiB
Penryn		P9xxx		6 MiB
Penryn-3M		T6xxx		2 MiB		35 W
Penryn-3M		T8xxx		3 MiB
Penryn		T9xxx		6 MiB
Penryn		E8x35		6 MiB	Socket P	35-55 W
Penryn-QC	Core 2 Quad	Q9xxx	4	2x3-2x6 MiB	Socket P	45 W
Penryn XE	Core 2 Extreme	X9xxx	2	6 MiB	Socket P	44 W
Penryn-QC	Core 2 Extreme	QX9xxx	4	2x6 MiB	Socket P	45 W
Penryn-3M	Celeron	T3xxx	2	1 MiB	Socket P	35 W
Penryn-3M		SU2xxx	2	1 MiB	µFC-BGA 956	10 W
Penryn-L		9x0	1	1 MiB	Socket P	35 W
Penryn-L		7x3	1	1 MiB	µFC-BGA 956	10 W
Penryn-3M	Pentium	T4xxx	2	1 MiB	Socket P	35 W
Penryn-3M		SU4xxx	2	2 MiB	µFC-BGA 956	10 W
Penryn-L		SU2xxx	1	2 MiB	µFC-BGA 956	5.5 W
Wolfdale-3M
	Celeron	E3xxx	2	1 MB	LGA 775	65 W
	Pentium	E2210		1 MB
		E5xxx		2 MB
		E6xxx		2 MB
	Core 2 Duo	E7xxx		3 MB
Wolfdale	Core 2 Duo	E8xxx		6 MB
Wolfdale	Xeon	31x0				45-65 W
Wolfdale-CL		30x4	1		LGA 771	30 W
Wolfdale-CL		31x3	2		LGA 771	65 W
Yorkfield	Xeon	X33x0	4	2×3–2×6 MB	LGA 775	65–95 W
Yorkfield-CL	Xeon	X33x3		2×3–2×6 MB	LGA 771	80 W
Yorkfield-6M	Core 2 Quad	Q8xxx		2×2 MB	LGA 775	65–95 W
Yorkfield-6M		Q9x0x		2×3 MB
Yorkfield		Q9x5x		2×6 MB
Yorkfield XE	Core 2 Extreme	QX9xxx		2×6 MB		130–136 W
Yorkfield XE	Core 2 Extreme	QX9xx5		2×6 MB	LGA 771	150 W
Wolfdale-DP	Xeon	E52xx	2	6 MB	LGA 771	65 W
		L52xx				20-55 W
		X52xx				80 W
Harpertown		E54xx	4	2×6 MB	LGA 771	80 W
		L54xx				40-50 W
		X54xx				120-150 W

Processor cores[edit]

	fab	cores	Mobile		Desktop, UP Server		CL Server	DP Server	MP Server
Single-Core 45 nm	45 nm	1		Penryn-L 80585				Wolfdale-CL 80588
Dual-Core 45 nm	45 nm	2	Penryn-3M 80577	Penryn 80576	Wolfdale-3M 80571	Wolfdale 80570	Wolfdale-CL 80588	Wolfdale-DP 80573
Quad-Core 45 nm	45 nm	4		Penryn-QC 80581	Yorkfield-6M 80580	Yorkfield 80569	Yorkfield-CL 80584	Harpertown 80574	Dunnington QC 80583
Six-Core 45 nm	45 nm	6							Dunnington 80582

Steppings using 45 nm process[edit]

Stepping	Released	Area	CPUID	L2 cache	Max. clock	Celeron	Pentium	Core 2	Celeron	Pentium	Core 2	Xeon	Core 2	Xeon	Xeon
						Mobile (Penryn)			Desktop (Wolfdale)				Desktop (Yorkfield)		Server (Wolfdale-DP,Harpertown, Dunnington)
C0	Nov 2007	107 mm²	10676	6 MiB	3.00 GHz			E8000 P7000 T8000 T9000 P9000 SP9000 SL9000 X9000			E8000	3100	QX9000		5200 5400
M0	Mar 2008	82 mm²	10676	3 MiB	2.40 GHz	7xx		SU3000 P7000 P8000 T8000 SU9000		E5000 E2000	E7000
C1	Mar 2008	107 mm²	10677	6 MiB	3.20 GHz								Q9000 QX9000	3300
M1	Mar 2008	82 mm²	10677	3 MiB	2.50 GHz								Q8000 Q9000	3300
E0	Aug 2008	107 mm²	1067A	6 MiB	3.33 GHz			T9000 P9000 SP9000 SL9000 Q9000 QX9000			E8000	3100	Q9000 Q9000S QX9000	3300	5200 5400
R0	Aug 2008	82 mm²	1067A	3 MiB	2.93 GHz	7xx 900 SU2000 T3000	T4000 SU2000 SU4000	SU3000 T6000 SU7000 P8000 SU9000	E3000	E5000 E6000	E7000		Q8000 Q8000S Q9000 Q9000S	3300
A1	Sep 2008	503 mm²	106D1	3 MiB	2.67 GHz										7400

In mobile processors, stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform, whereas stepping E0/R0 supports the later Intel Mobile 4 Express (Montevina) platform.

Model 30 stepping A1 (cpuid 106d1h) adds an L3 cache as well as six instead of the usual two cores, which leads to an unusually large die size of 503 mm².^[1] As of February 2008, it has only found its way into the very high-end Xeon 7400 series (Dunnington).

Roadmap[edit]

The main article for this category is Intel Tick-Tock.

Nehalem (microarchitecture)

From Wikipedia, the free encyclopedia

For other uses, see Nehalem (disambiguation).

Nehalem

L1 cache	64 KB per core
L2 cache	256 KB per core
L3 cache	4 MB to 12 MB shared
Predecessor	Core (tock) Penryn (tick)
Successor	Westmere (tick) Sandy Bridge (tock)
Socket(s)	LGA 1156 LGA 1366 LGA 1567 µPGA 988

Nehalem /nəˈheɪləm/^[1] is the codename for an Intel processor microarchitecture, successor to the Core microarchitecture.^[2] Nehalem processors use the 45 nmprocess. A preview system with two Nehalem processors was shown at Intel Developer Forum in 2007. The first processor released with the Nehalem architecture was the desktop Core i7,^[3] which was released in November 2008.

Nehalem, a recycled Intel code name, refers to an architecture that differs radically from Netburst, while retaining some of the latter's minor features. Nehalem-based microprocessors use higher clock speeds and are more energy-efficient than Penryn microprocessors. Hyper-threading is reintroduced, along with a reduction in L2 cache size, as well as an enlarged L3 cache that is shared by all cores. Nehalem was replaced with the Sandy Bridge microarchitecture, released in January 2011.

[hide]

Technology[edit]

Microarchitecture of a processor core in the quad-core implementation

Hyper-threading reintroduced.
4–12 MB L3 cache
Second-level branch predictor and translation lookaside buffer
Native (all processor cores on a single die) quad- and octa-core processors
Intel QuickPath Interconnect in high-end models replacing the legacy front side bus
64 KB L1 cache/core (32 KB L1 Data + 32 KB L1 Instruction) and 256 KB L2 cache/core.
Integration of PCI Express and DMI into the processor in mid-range models, replacing the northbridge
Integrated memory controller supporting two or three memory channels of DDR3 SDRAM or four FB-DIMM2 channels
2nd generation Intel Virtualization Technology, which introduced Extended Page Table support, virtual processor identifiers (VPIDs), and non-maskable interrupt-window exiting ^[4]

TLB Sizes^[5]

Cache		Page Size
Name	Level	4 kB	2 MB
DTLB	1st	64	32
ITLB	1st	128	7/logical core
STLB	2nd	512	none

Performance and power improvements[edit]

It has been reported that Nehalem has a focus on performance, thus the increased core size.^[6] Compared to Penryn, Nehalem has:

10-25% more single-threaded performance / 20-100% more multithreaded performance at the same power level
30% lower power consumption for the same performance
Nehalem provides a 15–20% clock-for-clock increase in performance per core(average)

Overclocking is possible with Bloomfield processors and the X58 chipset. Lynnfield processors use a PCH removing the need for a northbridge chipset.^[7]

Nehalem processors incorporate SSE 4.2 SIMD instructions, adding 7 new instructions to the SSE 4.1 set in the Core 2 series. The Nehalem architecture reduces atomic operation latency by 50% in an attempt to eliminate atomic overhead .^[8]

Variants Overview[edit]

Processing Cores (interface)	Process	Die Size	CPUID	Model	Stepping	Mobile	Desktop, UP Server	DP Server	MP Server
Eight-Core (Quad-Channel)	45 nm	684 mm²	206E6	46	D0				Beckton (80604)
Quad-Core (Triple-Channel)	45 nm	263 mm²	106A4 106A5	26	C0 D0		Bloomfield (80601)	Gainestown (80602)
Quad-Core (Dual-Channel, PCIe)	45 nm	296 mm²	106E4 106E5	30	B0 B1	Clarksfield (80607)	Lynnfield (80605)	Jasper Forest (80612)
Dual-Core (Dual-Channel, PCIe, Graphics Core)	45 nm					Auburndale (canceled)	Havendale (canceled)

Lynnfield processors feature integrated PCIe 1 x16 or 2 x8.
¹ 6500 series scalable up to 2 sockets, 7500 series scalable up to 4/8 sockets.^[9]

Server and desktop processors[edit]

Codename	Market	Cores / Threads	Socket	Processor Branding & Model		CPU Clock rate	Turbo	TDP	Interfaces		L3 cache	Release Date	Price for 1k Unit
Codename	Market	Cores / Threads	Socket	Processor Branding & Model		CPU Clock rate	Turbo	TDP	Chipset	Memory	L3 cache	Release Date	Price for 1k Unit
Beckton¹	MP Server / DP Server	8 (16)	LGA 1567	Xeon ^[10]	X7560	2.26 GHz	Yes	130 W	4× QPI 6.4 GT/s	DDR3-800 / 1066 (Up to 4x with SMB-Ready Motherboard)	24 MB	2010-03-30^[11]	$3692
					X7550	2.0 GHz					18 MB		$2837
					X6550	2.0 GHz					18 MB		$2461
					L7555	1.86 GHz		95 W	4× QPI 5.86 GT/s		24 MB		$3157
		6 (12)			E7540	2.0 GHz		105 W	4× QPI 6.4 GT/s		18 MB		$1980
					E6540	2.0 GHz			4× QPI 6.4 GT/s		12 MB		$1712
					E7530	1.86 GHz			4× QPI 5.86 GT/s		12 MB		$1391
					L7545	1.86 GHz					18 MB		$2087
		6 (6)			X7542	2.66 GHz		130 W					$1980
		4 (8)			E7520	1.86 GHz	No	105 W	4× QPI 4.8 GT/s				$856
		4 (8)			E6510	1.73 GHz	No	105 W	4× QPI 4.8 GT/s		12 MB		$744
Gainestown	DP Server^[12]	4 (8)	LGA 1366	Xeon^[13]	W5590	3.33 GHz	Yes	130 W	2× QPI 6.4 GT/s	3× DDR3-1333¹	8 MB	2009-08-09	$1600
					W5580	3.2 GHz		130 W				2009-03-29^[14]	$1500
					X5570	2.93 GHz		95 W					$1286
					X5560	2.8 GHz							$1072
					X5550	2.66 GHz							$858
					E5540	2.53 GHz		80 W	2× 5.86 GT/s	3× DDR3-1066¹			$744
					E5530	2.4 GHz							$530
					E5520	2.26 GHz							$373
					L5530	2.4 GHz		60 W				2009-08-09	$744
					L5520	2.26 GHz						2009-03-30	$530
					L5518	2.13 GHz						2009-03-30	$
		4 (4)			E5507	2.26 GHz	No	80 W	2× 4.8 GT/s	3× DDR3-800¹	4 MB	2010-03-16	$266
					E5506	2.13 GHz		80 W				2009-03-29	$266
					L5506	2.13 GHz		60 W					$423
					E5504	2.0 GHz		80 W					$224
		2 (4)			L5508	2.0 GHz	Yes	38 W	2× 5.86 GT/s	3× DDR3-1066	8 MB		$
		2 (2)			E5503	2.0 GHz	No	80 W	2× 4.8 GT/s	3× DDR3-800	4 MB	2010-03-16	$224
		2 (2)			E5502	1.86 GHz	No	80 W	2× 4.8 GT/s	3× DDR3-800	4 MB	2009-03-29	$188
Bloomfield	UP Server^[15]	4 (8)		Xeon^[16]	W3580	3.33 GHz	Yes	130 W	1× QPI 6.4 GT/s	3× DDR3-1333	8 MB	2009-08-09	$999
					W3570	3.2 GHz			1× QPI 6.4 GT/s	3× DDR3-1333		2009-03-29^[16]	$999
					W3565	3.2 GHz			1× QPI 4.8 GT/s	3× DDR3-1066		2009-11-01	$562
					W3550	3.06 GHz						2009-08-09
					W3540	2.93 GHz						2009-03-29^[16]
					W3530	2.8 GHz						2010-03-16	$294
					W3520	2.66 GHz						2009-03-29^[16]	$284
		2(2)			W3505	2.53 GHz	No				4 MB		$
		2(2)			W3503	2.4 GHz	No				4 MB		$
Lynnfield		4 (8)	LGA 1156		X3480	3.06 GHz	Yes	95 W	DMI	2× DDR3-1333	8 MB	2010-05-30	$612
					X3470	2.93 GHz						2009-09-08	$589
					X3460	2.8 GHz							$316
					X3450	2.66 GHz							$241
					X3440	2.53 GHz							$215
					L3426	1.86 GHz		45 W					$284
		4 (4)			X3430	2.4 GHz		95 W					$189
Bloomfield	Enthusiast Desktop^[17]	4 (8)	LGA 1366	Core i7 Extreme	975^[18]	3.33 GHz	Yes	130 W	1× QPI 6.4 GT/s	3× DDR3-1066		2009-05-31	$999
				Core i7 Extreme	965	3.2 GHz			1× QPI 6.4 GT/s			2008-11-17	$999
				Core i7	960^[19]	3.2 GHz			1× QPI 4.8 GT/s			2009-10-20	$562
					950^[18]	3.06 GHz						2009-05-31
					940	2.93 GHz						2008-11-17
					930	2.8 GHz						2010-02-28	$294
					920	2.66 GHz						2008-11-17	$284
Lynnfield	Performance Desktop		LGA 1156		880	3.06 GHz	Yes	95 W	DMI	2× DDR3-1333		2010-05-30	$583
					875K	2.93 GHz						2010-05-30	$342
					870^[20]	2.93 GHz						2009-09-08	$562
					870S	2.66 GHz		82 W				2010-07-19	$351
					860	2.8 GHz		95 W				2009-09-08	$284
					860S	2.53 GHz		82 W				2010-01-07	$337
		4 (4)		Core i5	760	2.8 GHz		95 W				2010-07-17	$209
					750^[21]	2.66 GHz		95 W				2009-09-08	$196
					750S	2.4 GHz		82 W				2010-01-07	$259

Intel states the Gainestown processors have six memory channels. Gainestown processors have dual QPI links and have a separate set of memory registers for each link in effect, a multiplexed six-channel system.^[22]^[23]

Mobile processors[edit]

Codename	Market	Cores / Threads	Socket	Processor Branding & Model		Core Clock rate	Turbo	TDP	L3 cache	Interface	Release Date	Price for 1k Unit
Clarksfield	Extreme / Performance Mobile	4 (8)	µPGA 988	Core i7 Extreme	940XM	2.13 GHz	Yes	55 W	8 MB	* DMI * 2x DDR3-1333 * PCIe 1 x16 / 2 x8	2010-06-21	$1096
				Core i7 Extreme	920XM	2.0 GHz		55 W			2009-09-23	$1054
				Core i7	840QM	1.86 GHz		45 W			2010-06-21	$568
					820QM	1.73 GHz					2009-09-23	$546
					740QM	1.73 GHz			6 MB		2010-06-21	$378
					720QM	1.6 GHz			6 MB		2009-09-23	$364

Roadmap[edit]

The main article for this category is Intel Tick-Tock.

The successor to Nehalem and Westmere is Sandy Bridge.

Intel CPU core roadmaps from NetBurst and P6 to Cannonlake

Westmere (microarchitecture)

From Wikipedia, the free encyclopedia

Westmere
L1 cache	64KB per core
L2 cache	256KB per core
L3 cache	4MB to 30MB shared
GPU	533 MHz to 900 MHz 177M 45nm (K0)
Predecessor	Nehalem
Successor	Sandy Bridge
Socket(s)	LGA 1156 LGA 1366 LGA 1567 µPGA 988

Connection of the GPU inside the Westemere microarchitecture

Westmere (formerly Nehalem-C) is the name given to the 32 nm die shrink of Nehalem. The first Westmere-based processors were launched on January 7, 2010 by Intel Corporation.

Westmere's feature improvements from Nehalem as reported:

Native six-core (Gulftown) and ten-core (Westmere-EX) processors.^[1]
A new set of instructions that gives over 3x the encryption and decryption rate of Advanced Encryption Standard (AES) processes compared to before.^[2]
- Delivers seven new instructions (AES instruction set or AES-NI) that will be used by the AES algorithm. Also an instruction called PCLMULQDQ (seeCLMUL instruction set) that will perform carry-less multiplication for use in cryptography.^[3] These instructions will allow the processor to perform hardware-accelerated encryption, not only resulting in faster execution but also protecting against software targeted attacks.
Integrated graphics, added into the processor package (dual core Arrandale and Clarkdale only).
Improved virtualization latency.^[4]
New virtualization capability: "VMX Unrestricted mode support," which allows 16-bit guests to run (real mode and big real mode).
Support for "Huge Pages" of 1 GB in size.

TLB Sizes^[5]

Cache		Page Size
Name	Level	4 kB	2 MB	1 GB
DTLB	1st	64	32	?
ITLB	1st	128	7/logical core	?
STLB	2nd	512	none	none

[hide]

CPU Variants[edit]

Processing Cores (interface)	Process	Die Size	CPUID	Model	Stepping	Mobile	Desktop, UP Server	DP Server	MP Server
Ten-Core (Quad-channel)^[6]	32 nm	513 mm²	206F2	47	A2				Westmere-EX (80615)
Six-Core (Triple-Channel)	32 nm	248 mm²	206C2	44	B1		Gulftown (80613)	Westmere-EP (80614)
Dual-Core (Dual-Channel, PCIe, Graphics Core)	32 nm 45 nm	81+114 mm²	20652 20655	37	C2 K0	Arrandale (80617)	Clarkdale (80616)

Westmere CPUs[edit]

TDP includes the integrated GPU, if present.
Clarkdale processors feature an integrated PCIe 1 ×16.
Clarkdale and Arrandale contain the 32 nm dual core processor Hillel and the 45 nm integrated graphics device Ironlake, and support switchable graphics.^[7]^[8]

Server / Desktop Processors[edit]

Codename	Market	Cores / Threads	Socket	Processor Branding & model		Clock rate		Turbo	TDP	Interfaces		L3 cache	Release Date	Price
Codename	Market	Cores / Threads	Socket	Processor Branding & model		Core	GPU	Turbo	TDP	Chipset	Memory	L3 cache	Release Date	Price
Westmere-EX ^[9]	MP Server	10 (20)	LGA 1567	Xeon	E7-8870	2.4 GHz	N/A	Yes	130 W	4× QPI 6.4 GT/s	4× DDR3-1066	30 MB	2011-04-05 ^[10]	$4616
					E7-4870									$4394
					E7-2870									$4227
					E7-8867L	2.13 GHz			105 W					$4172
					E7-8860	2.26 GHz			130 W			24 MB		$4061
					E7-4860									$3838
					E7-2860									$3670
					E7-8850	2 GHz								$3059
					E7-4850									$2837
					E7-2850									$2558
		8 (8)			E7-8837	2.66 GHz								$2280
		8 (16)			E7-8830	2.13 GHz			105 W					$2280
					E7-4830									$2059
					E7-2830									$1779
					E7-4820	2 GHz				4× QPI 5.86 GT/s		18 MB		$1446
					E7-2820	2 GHz				4× QPI 5.86 GT/s				$1334
		6 (12)			E7-4807	1.86 GHz		No	95 W	4× QPI 4.8 GT/s	4× DDR3-800			$890
		6 (12)			E7-2803	1.73 GHz		No	105 W	4× QPI 4.8 GT/s	4× DDR3-800			$774
Gulftown / Westmere-EP ^[11]	DP Server	6 (12)	LGA 1366	Xeon	X5690	3.46 GHz	N/A	Yes	130 W	2× QPI 6.4 GT/s	3× DDR3-1333	12 MB	2011-02-13	$1663
					X5680	3.33 GHz			130 W				2010-03-16	$1663
					X5675	3.06 GHz			95 W				2011-02-05	$1440
					X5670	2.93 GHz							2010-03-16	$1440
					X5660	2.8 GHz								$1219
					X5650	2.66 GHz								$996
					E5645	2.4 GHz			80 W	2× QPI 5.86 GT/s				$958
					L5640	2.26 GHz			60 W					$996
					L5638	2.0 GHz			60 W					$958
		4 (8)			X5677	3.46 GHz			130 W	2× QPI 6.4 GT/s				$1663
					X5667	3.06 GHz			95 W	2× QPI 6.4 GT/s				$1440
					E5640	2.66 GHz			80 W	2× QPI 5.86 GT/s	3× DDR3-1066			$774
					E5630	2.53 GHz								$551
					E5620	2.4 GHz								$387
					L5630	2.13 GHz			40 W					$551
					L5618	1.86 GHz								$530
		4 (4)			L5609	1.86 GHz		No		2× QPI 4.8 GT/s				$440
					L5607	2.26 GHz			80 W			8 MB	2011-02-13	$276
					L5606	2.13 GHz						8 MB		$219
					L5603	1.6 GHz						4 MB		$188
	UP Server	6 (12)		Xeon	W3690	3.46 GHz	N/A	Yes	130 W	1× QPI 6.4 GT/s	3× DDR3-1333	12 MB	2011-02-13^[12]	$999
					W3680	3.33 GHz				1× QPI 6.4 GT/s	3× DDR3-1333		2010-03-16^[13]	$999
					W3670	3.20 GHz				1× QPI 4.8 GT/s	3× DDR3-1066		2010-08-29	$885
	Extreme / Performance Desktop			Core i7 Extreme	990X	3.46 GHz				1× QPI 6.4 GT/s			2011-02-13	$999
				Core i7 Extreme	980X	3.33 GHz				1× QPI 6.4 GT/s			2010-03-16	$999
				Core i7	980	3.33 GHz				1× QPI 4.8 GT/s			2011-06-26	$583
				Core i7	970	3.20 GHz				1× QPI 4.8 GT/s			2010-07-17	$583
Clarkdale^[14]	UP Server	2 (4)	LGA 1156	Xeon	L3406	2.26 GHz	N/A	Yes	30 W	DMI	2× DDR3-1066	4 MB	2010-03-16	$189
	UP Server			Xeon	L3403	2.0 GHz	N/A		30 W		2× DDR3-1066		2010-10	$
	Mainstream / Value Desktop			Core i5	680	3.6 GHz	733 MHz		73 W		2× DDR3-1333		2010-04-18	$294
					670	3.46 GHz	733 MHz		73 W				2010-01-07	$284
					661	3.33 GHz	900 MHz		87 W					$196
					660	3.33 GHz	733 MHz		73 W					$196
					655K	3.2 GHz							2010-05-30	$216
					650	3.2 GHz							2010-01-07	$176
				Core i3	560	3.33 GHz		No					2010-08-29	$138
					550	3.20 GHz							2010-05-30	$138
					540	3.06 GHz							2010-01-07	$133
					530	2.93 GHz							2010-01-07	$113
		2 (2)		Pentium	G6960	2.93 GHz	533 MHz				2× DDR3-1066	3 MB	2011-01-09	$89
					G6951	2.8 GHz							Q3 2010	OEM
					G6950	2.8 GHz							2010-01-07	$87
				Celeron	G1101	2.26 GHz						2 MB	2010-01-07	OEM

Mobile Processors[edit]

Codename	Market	Cores / Threads	Processor Branding & Model		CPU Clock rate		GPU Clock rate	Turbo	TDP	Memory	L3 cache	Interface	Release Date	Price
Codename	Market	Cores / Threads	Processor Branding & Model		Standard	Turbo (1C/2C active cores )	GPU Clock rate	Turbo	TDP	Memory	L3 cache	Interface	Release Date	Price
Arrandale	Mainstream / Value Mobile	2 (4)	Core i7	640M	2.8 GHz	3.46/3.2 GHz	766 MHz	Yes	35 W	2× DDR3-1066	4 MB	* DMI * PCIe 1 x16 * Socket: µPGA-988 / BGA-1288	2010-09-26	$346
				620M	2.66 GHz	3.33/3.2 GHz							2010-01-07	$332
				610E	2.53 GHz	3.2/2.93 GHz							2010-01-07	$332
				660LM	2.26 GHz	3.06/2.8 GHz	566 MHz		25 W				2010-09-26	$346
				640LM	2.13 GHz	2.93/2.66 GHz							2010-01-07	$332
				620LM / 620LE	2.0 GHz	2.8/2.53 GHz							2010-01-07	$300
				680UM	1.46 GHz	2.53/2.16 GHz	500 MHz		18 W	2× DDR3-800			2010-09-26	$317
				660UM / 660UE	1.33 GHz	2.4/2.0 GHz							2010-05-25	$317
				640UM	1.2 GHz	2.26/1.86 GHz							2010-01-07	$305
				620UM / 620UE	1.06 GHz	2.13/1.76 GHz							2010-01-07	$278
			Core i5	580M	2.66 GHz	3.33/2.93 GHz	766 MHz		35 W	2× DDR3-1066	3 MB		2010-09-26	$266
				560M	2.66 GHz	3.2/2.93 GHz							2010-09-26	$225
				540M	2.53 GHz	3.06/2.8 GHz							2010-01-07	$257
				520M / 520E	2.4 GHz	2.93/2.66 GHz							2010-01-07	$225
				560UM	1.33 GHz	2.13/1.86 GHz	500 MHz		18 W	2× DDR3-800			2010-09-26	$250
				540UM	1.2 GHz	2.0/1.73 GHz							2010-05-25	$250
				520UM	1.06 GHz	1.86/1.6 GHz							2010-01-07	$241
				480M	2.66 GHz	2.93/2.93 GHz	766 MHz		35 W	2× DDR3-1066			2011-01-09	OEM
				460M	2.53 GHz	2.8/2.8 GHz							2010-09-26
				450M	2.4 GHz	2.66/2.66 GHz							2010-06-26
				430M	2.26 GHz	2.53/2.53 GHz							2010-01-07
				470UM	1.33 GHz	1.86/1.6 GHz	500 MHz		18 W	2× DDR3-800			2010-10-01
				430UM	1.2 GHz	1.73/1.46 GHz	500 MHz		18 W	2× DDR3-800			2010-05-25
			Core i3	390	2.66 GHz	n/a	667 MHz	No	35 W	2× DDR3-1066			2011-01-09
				380M	2.53 GHz								2010-09-26
				370M	2.4 GHz								2010-06-20
				350M	2.26 GHz								2010-01-07
				330M / 330E	2.13 GHz								2010-01-07
				380UM	1.33 GHz		500 MHz		18 W	2× DDR3-800			2010-10-01
				330UM	1.2 GHz		500 MHz		18 W	2× DDR3-800			2010-05-25
		2 (2)	Pentium	P6300	2.26 GHz		667 MHz		35 W	2× DDR3-1066			2011-01-09
				P6200	2.13 GHz								2010-09-26
				P6100	2.0 GHz								2010-09-26
				P6000	1.86 GHz								2010-06-20
				U5600	1.33 GHz		500 MHz		18 W	2× DDR3-800			2011-01-09
				U5400	1.2 GHz		500 MHz		18 W	2× DDR3-800			2010-05-25
			Celeron	P4600	2.0 GHz		667 MHz		35 W	2× DDR3-1066	2 MB		2010-09-26	$86
				P4500 / P4505	1.86 GHz		667 MHz		35 W	2× DDR3-1066			2010-03-28	OEM
				U3600	1.2 GHz		500 MHz		18 W	2× DDR3-800			2011-01-09	$134
				U3400 / U3405	1.06 GHz		500 MHz		18 W	2× DDR3-800 / 1066			2010-05-25	OEM

Roadmap[edit]

The main article for this category is Intel Tick-Tock.

The successor to Nehalem and Westmere is Sandy Bridge.

Sandy Bridge

From Wikipedia, the free encyclopedia

(Redirected from Sandy Bridge (microarchitecture))

Sandy Bridge
Max. CPU clock rate	1.60 GHz to 3.60 GHz
Product code	80623 (desktop)
L1 cache	64 KB per core
L2 cache	256 KB per core
L3 cache	1 MB to 8 MB shared 10 MB to 15 MB (Extreme) 3 MB to 20 MB (Xeon)
GPU	HD Graphics 2000 650 MHz to 1250 MHz
Predecessor	Nehalem (tock) Westmere (tick)
Successor	Ivy Bridge (tick) Haswell (tock)
Socket(s)	LGA 1155 LGA 2011 Socket G2 BGA-1023 BGA-1224 BGA-1284

Bottom view of a Sandy Bridge i7-2600k.

Sandy Bridge is the codename for a microarchitecture developed by Intel beginning in 2005 for central processing units in computers to replace the Nehalemmicroarchitecture. Intel demonstrated a Sandy Bridge processor in 2009, and released first products based on the architecture in January 2011 under the Corebrand.^[1]^[2]

Sandy Bridge implementations targeted a 32 nanometer manufacturing process based on planar double-gate transistors.^[3] Intel's subsequent product, codenamedIvy Bridge, uses a 22 nanometer process. The Ivy Bridge die shrink, known in the Intel Tick-Tock model as the "tick", is based on FinFET (non-planar, "3D") tri-gate transistors. Intel demonstrated the Ivy Bridge processors in 2011.^[4]

[hide]

Technology[edit]

Developed primarily by the Israel branch of Intel, the codename was originally "Gesher" (meaning "bridge" in Hebrew). The name was changed to avoid being associated with the defunct Gesher political party;^[5] the decision was led by Ron Friedman, vice president of Intel managing the group at the time.^[1] Intel demonstrated a Sandy Bridge processor with A1 stepping at 2 GHz during the Intel Developer Forum in September 2009.^[6]

Upgraded features from Nehalem include:

32 KB data + 32 KB instruction L1 cache (3 clocks) and 256 KB L2 cache (8 clocks) per core.
Shared L3 cache includes the processor graphics (LGA 1155).
64-byte cache line size.
Two load/store operations per CPU cycle for each memory channel.
Decoded micro-operation cache (uop cache) and enlarged, optimized branch predictor.
Improved performance for transcendental mathematics, AES encryption (AES instruction set), and SHA-1 hashing.
256-bit/cycle ring bus interconnect between cores, graphics, cache and System Agent Domain.
Advanced Vector Extensions (AVX) 256-bit instruction set with wider vectors, new extensible syntax and rich functionality.
Intel Quick Sync Video, hardware support for video encoding and decoding.
Up to 8 physical cores or 16 logical cores through Hyper-threading.
Integration of the GMCH (integrated graphics and memory controller) and processor into a single die inside the processor package. In contrast, Sandy Bridge's predecessor, Clarkdale, has two separate dies (one for GMCH, one for processor) within the processor package. This tighter integration reduces memory latency even more.
A 14- to 19-stage instruction pipeline, depending on the micro-operation cache hit or miss.^[7]

Translation lookaside buffer sizes^[8]^[9]
Cache		Page Size
Name	Level	4 KB	2 MB	1 GB
DTLB	1st	64	32	4
ITLB	1st	128	8 / logical core	none
STLB	2nd	512	none	none

All translation lookaside buffers (TLBs) are 4-way associative.^[10]

Models and steppings[edit]

All Sandy Bridge processors with one, two, or four cores report the same CPUID model 0206A7h^[11] and are closely related. The stepping number can not be seen from the CPUID but only from the PCI configuration space. The later Sandy Bridge-E processors with up to eight cores and no graphics are using CPUIDs 0206D6h and 0206D7h.^[12] Ivy Bridge CPUs all have CPUID 0306A9h to date, and are built in four different configurations differing in the number of cores, L3 cache and GPU execution units.

Die Code Name	CPUID	Stepping	Die size	Transistors	Cores	GPU EUs	L3 Cache	Sockets
Sandy Bridge-HE-4	`0206A7h`	D2	216 mm²	1.16 billion	4	12	8 MB	LGA 1155, Socket G2, BGA-1224, BGA-1023
Sandy Bridge-H-2		J1	149 mm²	624 million	2	12	4 MB	LGA 1155, Socket G2, BGA-1023
Sandy Bridge-M-2		Q0	131 mm²	504 million	2	6	3 MB	LGA 1155, Socket G2, BGA-1023
Sandy Bridge-EP-8	`0206D6h`	C1	435 mm²	2.27 billion	8	N/A	20 MB	LGA 2011
Sandy Bridge-EP-8	`0206D7h`	C2	435 mm²	2.27 billion	8	N/A	20 MB	LGA 2011
Sandy Bridge-EP-4	`0206D6h`	M0	294 mm²	1.27 billion	4	N/A	10 MB	LGA 2011
Sandy Bridge-EP-4	`0206D7h`	M1	294 mm²	1.27 billion	4	N/A	10 MB	LGA 2011
Ivy Bridge-M-2	`0306A9h`	P0	94 mm²^[13]		2	6^[14]	3 MB^[15]	LGA 1155, Socket G2, BGA-1224, BGA-1023
Ivy Bridge-H-2		L1	118 mm²^[13]		2	16	4 MB
Ivy Bridge-HE-4		E1	160 mm²^[13]	1.4 billion^[16]	4	16	8 MB
Ivy Bridge-HM-4		N0	133 mm²^[13]		4	6	6 MB^[15]

Performance[edit]

The average performance increase, according to IXBT Labs and Semi Accurate as well as many other benchmarking sites, at clock to clock is 11.3% compared to the Nehalem Generation, which includes Bloomfield, Clarkdale, and Lynnfield processors.^[17]
Around twice the integrated graphics performance compared to Clarkdale's (12 EUs comparison).

List of Sandy Bridge processors[edit]

¹Processors featuring Intel's HD 3000 graphics are set in bold. Other processors feature HD 2000 graphics or no graphics core (Graphics Clock rate indicated by N/A).

This list may not contain all the Sandy Bridge processors released by Intel. A more complete listing can be found on Intel's website.

Desktop platform[edit]

^[18] ^[19] ^[20]

Target segment	Processor Branding & Model		Cores (Threads)	CPU Clock rate		Graphics Clock rate		L3 Cache	TDP	Release Date (Y-M-D)	Price (USD)	Motherboard
Target segment	Processor Branding & Model		Cores (Threads)	Normal	Turbo	Normal	Turbo	L3 Cache	TDP	Release Date (Y-M-D)	Price (USD)	Socket	Interface	Memory
Extreme / High-End	Core i7 Extreme	3970X	6 (12)	3.5 GHz	4.0 GHz	N/A		15 MB	150 W	2012-11-12	$999	LGA 2011	DMI 2.0 PCIe 2.0^[21]	Up to quad channel DDR3-1600^[22]
	Core i7 Extreme	3960X		3.3 GHz	3.9 GHz			15 MB	130 W	2011-11-14	$999
	Core i7	3930K		3.2 GHz	3.8 GHz			12 MB		2011-11-14	$583
		3820	4 (8)	3.6 GHz	3.8 GHz			10 MB		2012-02-13^[23]	$294
Performance		2700K		3.5 GHz	3.9 GHz	850 MHz	1350 MHz	8 MB	95 W	2011-10-24	$332	LGA 1155	DMI 2.0 PCIe 2.0	Up to dual channel DDR3-1333
		2600K		3.4 GHz	3.8 GHz					2011-01-09	$317
		2600		3.4 GHz							$294
		2600S		2.8 GHz					65 W		$306
	Core i5	2550K	4 (4)	3.4 GHz		N/A		6 MB	95 W	2012-01-30	$225
		2500K		3.3 GHz	3.7 GHz	850 MHz	1100 MHz			2011-01-09	$216
		2500		3.3 GHz							$205
		2500S		2.7 GHz					65 W		$216
		2500T		2.3 GHz	3.3 GHz	650 MHz	1250 MHz		45 W		$216
		2450P		3.2 GHz	3.5 GHz	N/A			95 W	2012-01-30	$195
		2400		3.1 GHz	3.4 GHz	850 MHz	1100 MHz		95 W	2011-01-09	$184
		2405S		2.5 GHz	3.3 GHz				65 W	2011-05-22	$205
		2400S		2.5 GHz	3.3 GHz				65 W	2011-01-09	$195
		2380P		3.1 GHz	3.4 GHz	N/A			95 W	2012-01-30	$177
		2320		3.0 GHz	3.3 GHz	850 MHz	1100 MHz			2011-09-04
		2310		2.9 GHz	3.2 GHz					2011-05-22
		2300		2.8 GHz	3.1 GHz					2011-01-09
Mainstream		2390T	2 (4)	2.7 GHz	3.5 GHz	650 MHz		3 MB	35 W	2011-02-20	$195
	Core i3	2120T		2.6 GHz	N/A					2011-09-04	$127
		2100T		2.5 GHz						2011-02-20	$127
		2115C		2.0 GHz		N/A			25 W	2012-05	$241	BGA 1284
		2130		3.4 GHz		850 MHz	1100 MHz		65 W	2011-09-04	$138	LGA 1155
		2125		3.3 GHz						2011-09-04	$134
		2120		3.3 GHz						2011-02-20	$138
		2105		3.1 GHz						2011-05-22	$134
		2102								Q2 2011	$127
		2100								2011-02-20	$117
	Pentium	G870	2 (2)							2012-06-03	$86
		G860		3.0 GHz						2011-09-04	$86
		G860T		2.6 GHz		650 MHz			35 W	2012-06-03	$75
		G850		2.9 GHz		850 MHz			65 W	2011-05-24	$86
		G840		2.8 GHz						2011-05-24	$75
		G645		2.9 GHz						09-03-2012	$64			Up to dual channel DDR3-1066
		G640		2.8 GHz						06-03-2012	$64
		G632		2.7 GHz						Q3 2011
		G630		2.7 GHz						2011-09-04	$75
		G622		2.6 GHz						Q2 2011
		G620		2.6 GHz						2011-05-24	$64
		G645T		2.5 GHz		650 MHz			35 W	09-03-2012
		G640T		2.4 GHz						06-03-2012
		G630T		2.3 GHz						2011-09-04	$70
		G620T		2.2 GHz						2011-05-24	$70
	Celeron	G555		2.7 GHz		850 MHz	1000 MHz	2 MB	65 W	2012-09-02	$52
		G550		2.6 GHz						2012-06-03
		G540		2.5 GHz						2011-09-04
		G530		2.4 GHz						2011-09-04	$42
		G550T		2.2 GHz		650 MHz			35 W	2012-09-02
		G540T		2.1 GHz						2012-06-03
		G530T		2.0 GHz						2011-09-04	$47
		G470	1 (2)	2.0 GHz				1.5 MB		2013-06-09	$37			Up to dual channel DDR3-1333
		G465		1.9 GHz						2012-09-02				Up to dual channel DDR3-1066
		G460		1.8 GHz						2011-12-11
		G440	1 (1)	1.6 GHz				1 MB		2011-09-04
Target segment	Processor Branding & Model		Cores (Threads)	CPU Clock rate		Graphics Clock rate		L3 Cache	TDP	Release Date (Y-M-D)	Price (USD)	Motherboard
Target segment	Processor Branding & Model		Cores (Threads)	Normal	Turbo	Normal	Turbo	L3 Cache	TDP	Release Date (Y-M-D)	Price (USD)	Socket	Interface	Memory

Suffixes to denote:

K – Unlocked (adjustable CPU ratio up to 57 bins)
P – Versions clocked slightly higher than similar models, but with onboard-graphics deactivated.
S – Performance-optimized lifestyle (low power with 65W TDP)
T – Power-optimized lifestyle (ultra low power with 35-45W TDP)
X – Extreme performance (adjustable CPU ratio with no ratio limit)

NOTE:3960X,3930K and 3820 are actually of Sandy Bridge-E edition.

Server platform[edit]

Target Segment	Socket	Processor Branding & Model		Cores (Threads)	CPU Clock rate		Graphics Clock rate		L3 Cache	Interface	Supported Memory	TDP	Release Date	Price (USD)
Target Segment	Socket	Processor Branding & Model		Cores (Threads)	Standard	Turbo	Normal	Turbo	L3 Cache	Interface	Supported Memory	TDP	Release Date	Price (USD)
4P Server	LGA 2011	Xeon E5	4650	8 (16)	2.7 GHz	3.3 GHz	N/A		20 MB	2× QPI DMI 2.0 PCIe 3.0	4x DDR3-1600	130 W	2012-05-14	$3616
			4650L		2.6 GHz	3.1 GHz						115 W		$3616
			4640		2.4 GHz	2.8 GHz						95 W		$2725
			4620		2.2 GHz	2.6 GHz			16 MB		4x DDR3-1333	95 W		$1611
			4617	6 (6)	2.9 GHz	3.4 GHz			15 MB		4x DDR3-1600	130 W		$1611
			4610	6 (12)	2.4 GHz	2.9 GHz			15 MB		4x DDR3-1333	95 W		$1219
			4607	6 (12)	2.2 GHz	N/A			12 MB		4x DDR3-1066			$885
			4603	4 (8)	2.0 GHz	N/A			10 MB		4x DDR3-1066			$551
2P Server			2687W	8 (16)	3.1 GHz	3.8 GHz			20 MB		4x DDR3-1600	150 W	2012-03-06	$1885
			2690		2.9 GHz	3.8 GHz						135 W		$2057
			2680		2.7 GHz	3.5 GHz						130 W		$1723
			2670		2.6 GHz	3.3 GHz						115 W		$1552
			2665		2.4 GHz	3.1 GHz						115 W		$1440
			2660		2.2 GHz	3.0 GHz						95 W		$1329
			2658		2.1 GHz	2.4 GHz								$1186
			2650		2.0 GHz	2.8 GHz								$1107
			2650L		1.8 GHz	2.3 GHz						70 W		$1107
			2648L		1.8 GHz	2.1 GHz						70 W		$1186
			2667	6 (12)	2.9 GHz	3.5 GHz			15 MB			130 W		$1552
			2640		2.5 GHz	3.0 GHz					4x DDR3-1333	95 W		$884
			2630		2.3 GHz	2.8 GHz								$612
			2620		2.0 GHz	2.5 GHz								$406
			2630L		2.0 GHz	2.5 GHz						60 W		$662
			2643	4 (8)	3.3 GHz	3.5 GHz			10 MB		4x DDR3-1600	130 W		$884
			2609	4 (4)	2.4 GHz	N/A					4x DDR3-1066	80 W		$246
			2603	4 (4)	1.8 GHz	N/A					4x DDR3-1066			$202
			2637	2 (4)	3.0 GHz	3.5 GHz			5 MB		4x DDR3-1600			$884
	LGA 1356		2470	8 (16)	2.3 GHz	3.1 GHz			20 MB	1× QPI DMI 2.0 PCIe 3.0	3x DDR3-1600	95 W	2012-05-14	$1440
			2450		2.1 GHz	2.9 GHz						95 W		$1106
			2450L		1.8 GHz	2.3 GHz						70 W		$1106
			2440	6 (12)	2.4 GHz	2.9 GHz			15 MB		3x DDR3-1333	95 W		$834
			2430		2.2 GHz	2.7 GHz								$551
			2420		1.9 GHz	2.4 GHz								$388
			2430L		2.0 GHz	2.5 GHz						60 W		$662
			2407	4 (4)	2.2 GHz	N/A			10 MB		3x DDR3-1066	80 W		$250
			2403	4 (4)	1.8 GHz	N/A			10 MB		3x DDR3-1066	80 W		$192
1P Server	LGA 2011		1660	6 (12)	3.3 GHz	3.9 GHz			15 MB	2× QPI DMI 2.0 PCIe 3.0	Up to quad channel DDR3-1600	130 W	2012-03-06	$1080
			1650	6 (12)	3.2 GHz	3.8 GHz			12 MB					$583
			1620	4 (8)	3.6 GHz	3.8 GHz			10 MB					$294
			1607	4 (4)	3.0 GHz	N/A					Up to quad channel DDR3-1066			$244
			1603	4 (4)	2.8 GHz	N/A					Up to quad channel DDR3-1066			$198
	LGA 1356		1428L	6 (12)	1.8 GHz	N/A			15 MB	1× QPI DMI 2.0 PCIe 3.0	3x DDR3-1333	60 W	Q2 2012	$395
			1410	4 (8)	2.8 GHz	3.2 GHz			10 MB		3x DDR3-1333	80 W	2012-05-14
		Pentium	1407	2 (2)	2.8 GHz	N/A			5 MB		3x DDR3-1066	80 W	2012-05-14
			1405		1.2 GHz	1.8 GHz						40 W	August 2012	$143
			1403		2.6 GHz	N/A						80 W	2012-05-14
	LGA 1155	Xeon E3	1290	4 (8)	3.6 GHz	4.0 GHz			8 MB	DMI 2.0 PCIe 2.0	Up to dual channel DDR3-1333	95 W	2011-05-29	$885
			1280		3.5 GHz	3.9 GHz							2011-04-03	$612
			1275		3.4 GHz	3.8 GHz	850 MHz	1350 MHz						$339
			1270		3.4 GHz	3.8 GHz	N/A					80 W		$328
			1260L		2.4 GHz	3.3 GHz	650 MHz	1250 MHz				45 W		$294
			1245		3.3 GHz	3.7 GHz	850 MHz	1350 MHz				95 W		$262
			1240		3.3 GHz	3.7 GHz	N/A					80 W		$250
			1235		3.2 GHz	3.6 GHz	850 MHz	1350 MHz				95 W		$240
			1230		3.2 GHz	3.6 GHz	N/A					80 W		$215
			1225	4 (4)	3.1 GHz	3.4 GHz	850 MHz	1350 MHz	6 MB			95 W		$194
			1220	4 (4)	3.1 GHz		N/A		8 MB			80 W		$189
			1220L	2 (4)	2.2 GHz				3 MB			20 W		$189
	BGA 1284		1125C	4 (8)	2.0 GHz	N/A			8 MB		Up to dual channel DDR3-1600	40 W	May 2012	$444
	BGA 1284		1105C	4 (8)	1.0 GHz				6 MB		Up to dual channel DDR3-1600	25 W	May 2012	$333
	LGA 1155	Pentium	350	2 (4)	1.2 GHz				3 MB		Up to dual channel DDR3-1333	15 W	November 2011	$159
	BGA 1284	Celeron	725C	1 (2)	1.3 GHz				1.5 MB		Up to dual channel DDR3-1333	10 W	May 2012	$74

Mobile platform[edit]

Core i5-2515E and Core i7-2715QE processors have support for ECC memory and PCI express port bifurcation.
All mobile processors, except Celeron and Pentium, use Intel's Graphics sub-system HD 3000 (12 EUs).

Target Segment	Processor Branding & Model		Cores / Threads	CPU Clock rate		Graphics Clock rate		L3 Cache	TDP	Release Date	Price (USD)	Motherboard
Target Segment	Processor Branding & Model		Cores / Threads	Normal	Turbo (1C/2C/4C)	Normal	Turbo	L3 Cache	TDP	Release Date	Price (USD)	Interface	Socket
Extreme	Core i7 Extreme	2960XM	4 (8)	2.7 GHz	3.7/3.6/3.4 GHz	650 MHz	1300 MHz	8 MB	55 W	2011-09-04	$1096	DMI 2.0 Memory: Up to dual channel DDR3-1600 MHz *PCIe 2.0	Socket G2 / BGA-1224 (in embedded products)^[24]
Extreme	Core i7 Extreme	2920XM		2.5 GHz	3.5/3.4/3.2 GHz				55 W	2011-01-05	$1096
Performance	Core i7	2860QM		2.5 GHz	3.6/3.5/3.3 GHz				45 W	2011-09-04	$568
		2820QM		2.3 GHz	3.4/3.3/3.1 GHz					2011-01-05	$568
		2760QM		2.4 GHz	3.5/3.4/3.2 GHz			6 MB		2011-09-04	$378
		2720QM		2.2 GHz	3.3/3.2/3.0 GHz					2011-01-05
		2715QE		2.1 GHz	3.0/2.9/2.7 GHz		1200 MHz
		2710QE		2.1 GHz	3.0/2.9/2.7 GHz		1200 MHz
		2675QM		2.2 GHz	3.1/3.0/2.8 GHz		1200 MHz			2011-10-02		DMI 2.0 Memory: Up to dual channel DDR3-1333 MHz *PCIe 2.0
		2670QM		2.2 GHz	3.1/3.0/2.8 GHz		1100 MHz			2011-10-02
		2635QM		2.0 GHz	2.9/2.8/2.6 GHz		1200 MHz			2011-01-05
		2630QM		2.0 GHz	2.9/2.8/2.6 GHz		1100 MHz			2011-01-05
Mainstream		2640M	2 (4)	2.8 GHz	3.5/3.3 GHz		1300 MHz	4 MB	35 W	2011-09-04	$346		Socket G2 / BGA-1023 (in embedded products)^[24]
		2620M		2.7 GHz	3.4/3.2 GHz		1300 MHz		35 W	2011-02-20
		2649M		2.3 GHz	3.2/2.9 GHz	500 MHz	1100 MHz		25 W
		2629M		2.1 GHz	3.0/2.7 GHz	500 MHz	1100 MHz				$311
		2655LE		2.2 GHz	2.9/2.7 GHz	650 MHz	1000 MHz				$346
		2677M		1.8 GHz	2.9/2.6 GHz	350 MHz	1200 MHz		17 W	2011-06-20	$317
		2637M		1.7 GHz	2.8/2.5 GHz		1200 MHz			2011-06-20	$289
		2657M		1.6 GHz	2.7/2.4 GHz		1000 MHz			2011-02-20	$317
		2617M		1.5 GHz	2.6/2.3 GHz		950 MHz				$289
		2610UE		1.5 GHz	2.4/2.1 GHz		850 MHz				$317
	Core i5	2557M		1.7 GHz	2.7/2.4 GHz		1200 MHz	3 MB		2011-06-20	$250
		2537M		1.4 GHz	2.3/2.0 GHz		900 MHz			2011-02-20
		2467M		1.6 GHz	2.3/2.0 GHz		1150 MHz			2011-06-19
		2540M		2.6 GHz	3.3/3.1 GHz	650 MHz	1300 MHz		35 W	2011-06-20	$266
		2520M		2.5 GHz	3.2/3.0 GHz		1300 MHz				$225
		2515E			3.1/2.8 GHz		1100 MHz				$266
		2510E					1100 MHz				$266
		2450M					1300 MHz			2012-01	$225
		2435M		2.4 GHz	3.0/2.7 GHz		1300 MHz			2011-10-02	OEM
		2430M		2.4 GHz	3.0/2.7 GHz		1200 MHz			2011-10-02	$225
		2410M		2.3 GHz	2.9/2.6 GHz		1200 MHz			2011-06-20
	Core i3	2370M		2.4 GHz	N/A		1150 MHz			2012-01
		2350M		2.3 GHz						2011-10-02
		2348M		2.3 GHz						2013-01	OEM
		2330E		2.2 GHz			1050 MHz			2011-06-19	$225
		2330M					1100 MHz			2011-06-19
		2328M								2012-09
		2312M		2.1 GHz						Q2 2011	OEM
		2310E					1050 MHz			2011-02-20
		2310M					1100 MHz			2011-02-20
		2377M		1.5 GHz		350 MHz	1000 MHz		17 W	Q3 2012	$225
		2375M		1.5 GHz						2012-03	$225
		2367M		1.4 GHz						2011-10-02	$250
		2365M		1.4 GHz						2012-09	$225
		2357M		1.3 GHz			950 MHz			2011-06-19	OEM
		2340UE		1.3 GHz			800 MHz			2011-06-19	$250
	Pentium	B915C		1.5 GHz		N/A			15 W	2012-05	$138
		997	2 (2)	1.6 GHz		350 MHz	1000 MHz	2 MB	17 W	2012-09-30	$134
		987		1.5 GHz						Q3 2012
		977		1.4 GHz						2012-01
		967		1.3 GHz						2011-10-02	OEM
		957		1.2 GHz			800 MHz			2011-06-19	$134
		B980		2.4 GHz		650 MHz	1150 MHz		35 W	2012-09	OEM
		B970		2.3 GHz			1150 MHz			2012-01	$125
		B960		2.2 GHz			1100 MHz			2011-10-02	$134
		B950		2.1 GHz						2011-06-19
		B940		2.0 GHz						2011-06-19
	Celeron	B840		1.9 GHz			1000 MHz			2011-09-04	$86
		B830		1.8 GHz			1050 MHz			2012-09-30
		B820^[25]		1.7 GHz						2012-07-29
		B815^[26]		1.6 GHz						2012-01
		B810E					1000 MHz			2011-06-19
		B810					950 MHz			2011-03-13
		B800		1.5 GHz			1000 MHz			2011-06-19	$80
		887		1.5 GHz		350 MHz			17 W	09-30-2012	$86
		877		1.4 GHz						2012-07-29	$86
		867		1.3 GHz						January 2012	$134
		857		1.2 GHz						2011-07-03
		847		1.1 GHz			800 MHz			2011-06-19
		847E		1.1 GHz			800 MHz			2011-06-19
		807	1 (2)	1.5 GHz			950 MHz	1.5 MB		2012-07-29	$70
		725C	1 (2)	1.3 GHz		N/A			10 W	2012-05	$74
		827E	1 (1)	1.4 GHz		350 MHz	800 MHz		17 W	2011-07-03	$107
		797		1.4 GHz			950 MHz			2012-01
787		1.3 GHz		2011-07-03			950 MHz
B730		1.8 GHz		650 MHz		1000 MHz	35 W		2012-07-29	$70
B720^[27]		1.7 GHz							2012-01
B710		1.6 GHz							2011-06-19
807UE		1.0 GHz		350 MHz		800 MHz	1 MB	10 W	2011-11	$117

Suffixes to denote:

M – Mobile processors
- XM – Unlocked
- QM – Quad-core
E – Embedded mobile processors
- QE – Quad-core
- LE – Performance-optimized
- UE – Power-optimized

Cougar Point chipset flaw[edit]

On January 31, 2011, Intel issued a recall on all 67-series motherboards due to a flaw in the Cougar Point Chipset.^[28] A hardware problem, in which the chipset's SATA-II ports may fail over time, cause failure of connection to SATA-II devices, though data is not at risk.^[29] Intel claims that this problem will affect only 5% of users over 3 years, however, heavier I/O workloads can exacerbate the problem.

Intel stopped production of flawed B2 stepping chipsets and began producing B3 stepping chipsets with the silicon fix. Shipping of these new chipsets started on 14 February 2011 and Intel estimated full recovery volume in April 2011.^[30] Motherboard manufacturers (such as ASUS and Gigabyte Technology) and computer manufacturers (such as Dell and Hewlett-Packard) stopped selling products that involved the flawed chipset and offered support for affected customers. Options ranged from swapping for B3 motherboards to product refunds.^[31]^[32]

Sandy Bridge processor sales were temporarily on hold, as one cannot use the CPU without a motherboard. However, processor release dates were not affected.^[33] After two weeks, Intel continued shipping some chipsets, but manufacturers had to agree to a set of terms that will prevent customers from encountering the bug.^[34]

Limitations[edit]

Overclocking[edit]

With Sandy Bridge, Intel has tied the speed of every bus (USB, SATA, PCI, PCI-E, CPU cores, Uncore, memory etc.) to a single internal clock generator issuing the basic 100 MHz Base Clock (BClk).^[35]With CPUs being multiplier locked, the only way to overclock is to increase the BClk, which can be raised by only 5–7% without other hardware components failing. As a work around, Intel made available K/X-series processors, which feature unlocked multipliers; with a multiplier cap of 57 for Sandy Bridge.^[36] For the Sandy Bridge E platform, there is alternative method known as the BClk ratio overclock.^[37]

During IDF (Intel Developer Forum) 2010, Intel demonstrated an unknown Sandy Bridge CPU running stably overclocked at 4.9 GHz on air cooling.^[38]^[39]

Chipset[edit]

Non-K edition CPUs can overclock up to four bins from its turbo multiplier. Refer here for chipset support.

vPro remote-control (Intel Insider)[edit]

Sandy and Ivy Bridge processors with vPro capability have security features that can remotely disable a PC or erase information from hard drives. This can be useful in the case of a lost or stolen PC. The commands can be received through 3G signals, Ethernet, or Internet connections. AES encryption acceleration will be available, which can be useful for video conferencing and VoIP applications.^[40]^[41]

Software development kit[edit]

With the introduction of the Sandy Bridge microarchitecture, Intel also introduced the Intel Data Plane Development Kit (Intel DPDK) to help developers of communications applications take advantage of the platform in packet processing applications, and network processors.^[42]

Roadmap[edit]

Intel demonstrated the Haswell architecture in September 2011, released in 2013 as the successor to Sandy Bridge and Ivy Bridge.^[43]

Intel CPU core roadmaps from NetBurst and P6 to Cannonlake

Ivy Bridge (microarchitecture)

From Wikipedia, the free encyclopedia

Ivy Bridge

CPUID code	0306A9h
Product code	80637 (desktop)
L1 cache	64 KB per core
L2 cache	256 KB per core
L3 cache	2 MB to 8 MB shared
GPU	HD Graphics 2500 650 MHz to 1150 MHz HD Graphics 4000 350 MHz to 1300 MHz HD Graphics P4000 650 MHz to 1250 MHz
Predecessor	Sandy Bridge
Successor	Haswell
Socket(s)	LGA 1155 Socket G2 BGA-1023 BGA-1224

Ivy Bridge is the codename for a line of processors based on the 22 nm manufacturing process developed by Intel. The name is also applied more broadly to the22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET ("3D") tri-gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX(Ivytown), Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.

Ivy Bridge processors are backwards compatible with the Sandy Bridge platform, but such systems might require a firmware update (vendor specific).^[1] In 2011, Intel released the 7-series Panther Point chipsets with integrated USB 3.0 to complement Ivy Bridge.^[2]

Volume production of Ivy Bridge chips began in the third quarter of 2011.^[3] Quad-core and dual-core-mobile models launched on April 29, 2012 and May 31, 2012 respectively.^[4] Core i3 desktop processors, as well as the first 22 nm Pentium, were announced and available the first week of September, 2012.^[5]

[hide]

Overview[edit]

The Ivy Bridge CPU microarchitecture is a shrink from Sandy Bridge and remains largely unchanged.

Notable improvements include:^[6]^[7]

22 nm Tri-gate transistor ("3-D") technology (up to 50% less power consumption at the same performance level as 2-D planar transistors).^[8]
A new random number generator and the RdRand instruction,^[9] codenamed Bull Mountain.^[10]

Ivy Bridge features and performance[edit]

The mobile and desktop Ivy Bridge chips also include significant changes over Sandy Bridge:

F16C (16-bit Floating-point conversion instructions).
RdRand instruction (Intel Secure Key).
PCI Express 3.0 support (not on Core i3 and ULV processors).^[11]
Max CPU multiplier of 63 (57 for Sandy Bridge).^[12]
RAM support up to 2800 MT/s in 200 MHz increments.^[12]
The built-in GPU has 6 or 16 execution units (EUs), compared to Sandy Bridge's 6 or 12.^[13]
Intel HD Graphics with DirectX 11, OpenGL 3.1, and OpenCL 1.1 support.^[14] OpenGL 4.0 is supported with 9.18.10.3071 WHQL drivers^[15] and later drivers.
DDR3L and Configurable TDP (cTDP) for mobile processors.^[16]
Multiple 4K video playback.
Intel Quick Sync Video version 2.^[13]
Up to three displays are supported (with some limitations: with chipset of 7-series and using two of them with DisplayPort or eDP).^[17]
A 14- to 19-stage instruction pipeline, depending on the micro-operation cache hit or miss.^[18]

Translation lookaside buffersizes^[19]^[20]
Cache		Page Size
Name	Level	4 KB	2 MB	1 GB
DTLB	1st	64	32	4
ITLB	1st	128	8 / logical core	none
STLB	2nd	512	none	none

Benchmark comparisons[edit]

Compared to Sandy Bridge:

3% to 5% increase in CPU performance when compared clock for clock^[21]^[22]
25% to 68% increase in integrated GPU performance.^[23]

Thermal performance and heat issues[edit]

Ivy Bridge's temperatures are reportedly 10°C higher compared to Sandy Bridge when overclocked, even at default voltage setting.^[24] Impress PC Watch, a Japanese website, performed experiments that confirmed earlier speculations that this is because Intel used a poor quality (and perhaps lower cost) thermal interface material (thermal paste, or "TIM") between the chip and the heat spreader, instead of thefluxless solder of previous generations.^[25]^[26]^[27] The mobile Ivy Bridge processors are not affected by this issue because they do not use a heat spreader between the chip and cooling system.

Enthusiast reports describe the TIM used by Intel as low-quality,^[27] and not up to par for a "premium" CPU, with some speculation that this is by design to encourage sales of prior processors.^[25] Further analyses caution that the processor can be damaged or void its warranty if home users attempt to remedy the matter.^[25]^[28] The TIM has much lower thermal conductivity, causing heat to trap on the die.^[24]Experiments replacing this with a higher quality TIM or other heat removal methods showed a substantial temperature drop, and improvements to the voltages and clocking sustainable by Ivy Bridge chips.^[25]^[29]

Intel claims that the smaller die of Ivy Bridge and the related increase in thermal density is expected to result in higher temperatures when the CPU is overclocked; Intel also stated that this is as expected and will likely not improve in future revisions.^[30]

Models and steppings[edit]

All Ivy Bridge processors with one, two, or four cores report the same CPUID model 0x000306A9, and are built in four different configurations differing in the number of cores, L3 cache and GPU execution units.

Die Code Name	CPUID	Stepping	Die Size	Die Dimensions	Transistors	Cores	GPU EUs	L3 Cache	Sockets
Ivy Bridge-M-2	`0x000306A9`	P0	94 mm²^[31]	7.656 x 12.223 mm		2	6^[32]	3 MB^[33]	LGA 1155, Socket G2, BGA-1224, BGA-1023
Ivy Bridge-H-2		L1	118 mm²^[31]	8.141 x 14.505 mm		2	16	4 MB
Ivy Bridge-HE-4		E1	160 mm²^[31]	8.141 x 19.361 mm	1.4 billion^[34]	4	16	8 MB
Ivy Bridge-HM-4		N0	133 mm²^[31]	7.656 x 17.349 mm		4	6	6 MB^[33]

Ivy Bridge-E features[edit]

Ivy Bridge-E
CPUID code	0306Fxh
Product code	80633
L1 cache	32 KB per core
L2 cache	256 KB per core
L3 cache	15 MB shared
Predecessor	Sandy Bridge-E
Successor	Haswell-E
Socket(s)	LGA 2011

Ivy Bridge-EN
CPUID code	0306Fxh
Product code	80634
L1 cache	32 KB per core
L2 cache	256 KB per core
L3 cache	10 MB to 25 MB shared
Predecessor	Sandy Bridge-EN
Successor	Haswell-EN
Socket(s)	LGA 1356

Ivy Bridge-EP
CPUID code	0306Fxh
Product code	80635
L1 cache	32 KB per core
L2 cache	256 KB per core
L3 cache	10 MB to 30 MB shared
Predecessor	Sandy Bridge-EP
Successor	Haswell-EP
Socket(s)	LGA 2011

Ivy Bridge-EX
CPUID code	0306Fxh
Product code	80636
L1 cache	32 KB per core
L2 cache	256 KB per core
L3 cache	12 MB to 37.5 MB shared
Predecessor	Westmere-EX
Successor	?
Socket(s)	LGA 2011

Ivy Bridge-E is the follow-up to Sandy Bridge-E, using the same CPU core as the Ivy Bridge processor, but in an LGA 2011 or LGA 1356 package for workstations and servers.

New RAS features for Ivybridge-EX
Dual-Memory Controller for Ivybridge-EP
No integrated GPU
Up to 15 CPU cores
Up to 37.5 MB L3 cache.^[35]
Thermal design power between 60 W and 155 W
Support for up to 8 DIMMS of DDR3-1866 memory per socket

Models and Steppings[edit]

The Ivy Bridge-E family is made in three different versions, by number of cores, and for three market segments: the basic Ivy Bridge-E is a single-socket processor sold as Core i7-49xx and is only available in the six-core S1 stepping, with some versions limited to four active cores.

Ivy Bridge-EN (Xeon E5-14xx v2 and Xeon E5-24xx v2) is the model for single- and dual-socket servers using LGA 1356 with up to 10 cores, while Ivy Bridge-EP (nd Xeon E5-16xx v2, Xeon E5-26xx v2 and Xeon E5-46xx v2) scales up to four LGA 2011 sockets and up to 12 cores per chip and Ivybridge-EX will have up to 15 cores and scale to 8 sockets.

Die Code Name	CPUID	Stepping	Die size	Transistors	Cores	L3 Cache	Socket
Ivy Bridge-E-6	`0x0306Fx`	S1	256.5 mm²	1.86 billion	6	15 MB	LGA 2011
Ivy Bridge-EN-6							LGA 1356
Ivy Bridge-EP-6							LGA 2011
Ivy Bridge-EN-10		M1	346.5 mm²	2.86 billion	10	25 MB	LGA 1356
Ivy Bridge-EP-10		M1	346.5 mm²	2.86 billion	10	25 MB	LGA 2011
Ivy Bridge-EX-15		C1	541 mm²	4.3 billion	15	37.5 MB	LGA 2011

List of Ivy Bridge and Ivy Bridge-E processors[edit]

Processors featuring Intel's HD 4000 graphics (or HD P4000 for Xeon) are set in bold. Other processors feature HD 2500 graphics unless indicated by N/A.

Desktop processors[edit]

List of announced desktop processors as follows:

Target segment	Cores (Threads)	Processor Branding & Model		CPU Clock rate		Graphics Clock rate		L3 Cache	TDP	Release Date	Release price (USD)	Motherboard
Target segment	Cores (Threads)	Processor Branding & Model		Normal	Turbo	Normal	Turbo	L3 Cache	TDP	Release Date	Release price (USD)	Socket	Interface	Memory
Extreme / High-End	6 (12)	Core i7 Extreme	4960X	3.6 GHz	4.0 GHz	N/A		15 MB	130 W	2013-09-10	$999^[36]	LGA 2011	DMI 2.0 PCIe 3.0*	Up to quad channel DDR3-1866
	6 (12)	Core i7	4930K	3.4 GHz	3.9 GHz			12 MB			$583^[36]
	4 (8)		4820K	3.7 GHz	3.9 GHz			10 MB			$323^[36]
Performance			3770K	3.5 GHz	3.9 GHz	650 MHz	1150 MHz	8 MB	77 W	2012-04-23	$332	LGA 1155	DMI 2.0 PCIe 3.0^∗	Up to dual channel DDR3-1600^[37]
			3770	3.4 GHz					77 W		$294
			3770S	3.1 GHz					65 W
			3770T	2.5 GHz	3.7 GHz				45 W
Mainstream	4 (4)	Core i5	3570K	3.4 GHz	3.8 GHz			6 MB	77 W		$225
			3570	3.4 GHz					77 W	2012-05-31^[38]	$205
			3570S	3.1 GHz					65 W
			3570T	2.3 GHz	3.3 GHz				45 W
			3550	3.3 GHz	3.7 GHz				77 W	2012-04-23
			3550S	3.0 GHz	3.7 GHz				65 W	2012-04-23
			3475S	2.9 GHz	3.6 GHz		1100 MHz		65 W	2012-05-31^[38]	$201
			3470	3.2 GHz					77 W		$184
			3470S	2.9 GHz					65 W
	2 (4)		3470T	2.9 GHz				3 MB	35 W
	4 (4)		3450	3.1 GHz	3.5 GHz			6 MB	77 W	2012-04-23
			3450S	2.8 GHz	3.5 GHz				65 W	2012-04-23
			3350P	3.1 GHz	3.3 GHz	N/A			69 W	2012-09-03	$177
			3340	3.1 GHz		650 MHz	1050 MHz		77 W	2013-09-01	$182
			3340S	2.8 GHz					65 W	2013-09-01	$182
			3335S	2.7 GHz	3.2 GHz					2012-09-03	$194
			3330S	2.7 GHz							$177
			3330	3.0 GHz					77 W		$182
	2 (4)	Core i3	3250	3.5 GHz	N/A			3 MB	55 W	2013-06-09	$138		DMI 2.0 PCIe 2.0
			3245	3.4 GHz						2013-06-09	$134
			3240	3.4 GHz						2012-09-03	$138
			3225	3.3 GHz							$134
			3220	3.3 GHz							$117
			3210	3.2 GHz						2013-01-20	$117
			3250T	3.0 GHz					35 W	2013-06-09	$138
			3240T	2.9 GHz						2012-09-03	$138
			3220T	2.8 GHz						2012-09-03	$117
	2 (2)	Pentium	G2140	3.3 GHz					55 W	2013-06-09	$86
			G2130	3.2 GHz						2013-01-20
			G2120	3.1 GHz						2012-09-03
			G2120T	2.7 GHz					35 W	2013-06-09	$75
			G2100T	2.6 GHz					35 W	2012-09-03	$75
			G2030	3.0 GHz					55 W	2013-06-09	$64			Dual channel DDR3-1333
			G2020	2.9 GHz						2013-01-20
			G2010	2.8 GHz						2013-01-20
			G2030T	2.6 GHz					35 W	2013-06-09
			G2020T	2.5 GHz					35 W	2013-01-20
	2 (2)	Celeron	G1630	2.8 GHz				2 MB	55 W	2013-09-01	$52
			G1620	2.7 GHz						2013-01-20	$52
			G1610	2.6 GHz						2013-01-20	$42
			G1620T	2.4 GHz					35 W	2013-09-01
			G1610T	2.3 GHz					35 W	2013-01-20

^∗ Requires a compatible Motherboard

Suffixes to denote:

K - Unlocked (adjustable CPU multiplier up to 63 bins)
S - Performance-optimized lifestyle (low power with 65 W TDP)
T - Power-optimized lifestyle (ultra low power with 35-45 W TDP)
P - No on-die video chipset
X – Extreme performance (adjustable CPU ratio with no ratio limit)

Server processors[edit]

Additional high-end server processors based on the Ivy Bridge architecture, code named Ivytown, were announced September 10, 2013 at the Intel Developer Forum, after the usual one year interval between consumer and server product releases.^[39]^[40]^[41] The Ivy Bridge-EP processor line announced in September 2013 has up to 12 cores and 30 MB third level cache, with rumors of Ivy Bridge-EX up to 15 cores and an increased third level cache of up to 37.5 MB,^[42]^[43] although an early leaked lineup of Ivy Bridge-E included processors with a maximum of 6 cores.^[44] Both Core-i7 and Xeon versions are produced: the Xeon versions marketed as Xeon E5-2600 V2 act as drop-in replacements for the existing Sandy Bridge-EN and Sandy Bridge-EP based Xeon E5, and Core-i7 versions designated i7-4820K, i7-4930K, i7-4960X were released on September 10, 2013 remained compatible with X79 and LGA2011 hardware.^[43]^[45]

A new Ivy Bridge-EX line marketed as Xeon E7 V2 had no corresponding predecessor using the Sandy Bridge microarchitecture but instead followed the older Westmere-EX processors.

Target Segment	Cores (Threads)	Processor Branding & Model		CPU Clock rate		Graphics Clock rate		L3 Cache	TDP	Release Date	Price (USD)	Motherboard
Target Segment	Cores (Threads)	Processor Branding & Model		Normal	Turbo	Normal	Turbo	L3 Cache	TDP	Release Date	Price (USD)	Socket	Interface	Memory
2P Server	12 (24)	Xeon E5	2697v2	2.7 GHz	3.5 GHz	N/A		30 MB	130 W	2013-09-10	$2614	LGA 2011	2× QPI DMI 2.0 PCIe 3.0	Up to quad channel DDR3-1866
			2695v2	2.4 GHz	3.2 GHz				115 W	2013-09-10	$2336
			2692v2	2.2 GHz	3.0 GHz				115 W	2013-06	OEM (Tianhe-2)
			2651v2	1.8 GHz	?				?	2013-09-10
	10 (20)		2690v2	3.0 GHz	3.6 GHz			25 MB	130 W		$2057
			2680v2	2.8 GHz	3.6 GHz				115 W		$1723
			2670v2	2.5 GHz	3.3 GHz				115 W		$1552
			2660v2	2.2 GHz	3.0 GHz				95 W		$1389
			2658v2	2.4 GHz	3.0 GHz				95 W		$1440
			2650Lv2	1.7 GHz	2.1 GHz				70 W		$1219			Up to quad channel DDR3-1600
			2648Lv2	1.9 GHz	2.5 GHz				70 W		$1218			Up to quad channel DDR3-1866
	8 (16)		2687Wv2	3.4 GHz	4.0 GHz				150 W		$2108
			2667v2	3.3 GHz	4.0 GHz				130 W		$2057
			2650v2	2.6 GHz	3.4 GHz			20 MB	95 W		$1166
			2640v2	2.0 GHz	2.5 GHz				95 W		$885			Up to quad channel DDR3-1600
			2628Lv2	1.9 GHz	2.4 GHz				70 W		$1000			Up to quad channel DDR3-1600
	6 (12)		2643v2	3.5 GHz	3.8 GHz			25 MB	130 W		$1552			Up to quad channel DDR3-1866
			2630v2	2.6 GHz	3.1 GHz			15 MB	80 W		$612			Up to quad channel DDR3-1600
			2630Lv2	2.4 GHz	2.8 GHz				60 W		$612
			2620v2	2.1 GHz	2.6 GHz				80 W		$406
			2618Lv2	2.0 GHz	N/A				50 W		$520			Up to quad channel DDR3-1333
	4 (8)		2637v2	3.5 GHz	3.8 GHz				130 W		$996			Up to quad channel DDR3-1866
	4 (4)		2609v2	2.5 GHz	N/A			10 MB	80 W		$294			Up to quad channel DDR3-1333
	4 (4)		2603v2	1.8 GHz	N/A			10 MB	80 W		$202			Up to quad channel DDR3-1333
1P Server	8 (16)		1680v2	3.0 GHz	3.9 GHz			25 MB	130 W		$1723		0× QPI DMI 2.0 PCIe 3.0	Up to quad channel DDR3-1866
	6 (12)		1660v2	3.7 GHz	4.0 GHz			15 MB			$1080
	6 (12)		1650v2	3.5 GHz	3.9 GHz			12 MB			$583
	4 (8)		1620v2	3.7 GHz	3.9 GHz			10 MB			$294
	4 (4)		1607v2	3.0 GHz	N/A			10 MB			$244			Up to quad channel DDR3-1600
	4 (8)	Xeon E3	1290v2	3.7 GHz	4.1 GHz			8 MB	87 W	2012-05-14	$885	LGA 1155	DMI 2.0 PCIe 3.0^?	Up to dual channel DDR3-1600
			1280v2	3.6 GHz	4.0 GHz				69 W		$623
			1275v2	3.5 GHz	3.9 GHz	650 MHz	1.25 GHz		77 W		$350
			1270v2	3.5 GHz	3.9 GHz	N/A			69 W		$339
			1265Lv2	2.5 GHz	3.5 GHz	650 MHz	1.15 GHz		45 W		$305
			1245v2	3.4 GHz	3.8 GHz	650 MHz	1.25 GHz		77 W		$273
			1240v2	3.4 GHz	3.8 GHz	N/A			69 W		$261
			1230v2	3.3 GHz	3.7 GHz	N/A			69 W		$230
	4 (4)		1225v2	3.2 GHz	3.6 GHz	650 MHz	1.25 GHz		77 W		$224
	4 (4)		1220v2	3.1 GHz	3.5 GHz	N/A			69 W		$203
	2 (4)		1220Lv2	2.3 GHz	3.5 GHz	N/A		3 MB	17 W		$189

^? Requires a compatible Motherboard

Mobile processors[edit]

Target segment	Cores (Threads)	Processor Branding & Model		Programmable TDP				CPU Turbo	Graphics Clock rate		L3 Cache	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		SDP^[46]	cTDP down	Nominal TDP	cTDP up	1-core	Normal	Turbo	L3 Cache	Release Date	Price (USD)
Performance	4 (8)	Core i7	3940XM	N/A	45 W / ? GHz	55 W / 3.0 GHz	65 W / ? GHz	3.9 GHz	650 MHz	1350 MHz	8 MB	2012-09-30	$1096
			3920XM		45 W / ? GHz	55 W / 2.9 GHz	65 W / ? GHz	3.8 GHz		1300 MHz		2012-04-23	$1096
			3840QM		N/A	45 W / 2.8 GHz	N/A	3.8 GHz		1300 MHz		2012-09-30	$568
			3820QM			45 W / 2.7 GHz		3.7 GHz		1250 MHz		2012-04-23	$568
			3740QM			45 W / 2.7 GHz		3.7 GHz		1300 MHz	6 MB	2012-09-30	$378
			3720QM			45 W / 2.6 GHz		3.6 GHz		1250 MHz		2012-04-23	$378
			3635QM			45 W / 2.4 GHz		3.4 GHz		1200 MHz		2012-09-30	N/A
			3632QM			35 W / 2.2 GHz		3.2 GHz		1150 MHz			$378
			3630QM			45 W / 2.4 GHz		3.4 GHz		1150 MHz
			3615QM			45 W / 2.3 GHz		3.3 GHz		1200 MHz		2012-04-23
			3612QM			35 W / 2.1 GHz		3.1 GHz		1100 MHz
			3610QM			45 W / 2.3 GHz		3.3 GHz		1100 MHz
Mainstream	2 (4)		3689Y	7 W / ? GHz	10 W /	13 W / 1.5 GHz		2.6 GHz	350 MHz	850 MHz	4 MB	2013-01-07	$362
			3687U	N/A	14 W / ? GHz	17 W / 2.1 GHz	25 W / 3.1 GHz	3.3 GHz		1200 MHz		2013-01-20	$346
			3667U		14 W / ? GHz	17 W / 2.0 GHz	25 W / 3.0 GHz	3.2 GHz		1150 MHz		2012-06-03
			3537U		14 W / ? GHz	17 W / 2.0 GHz	25 W / 2.9 GHz	3.1 GHz		1200 MHz		2013-01-20
			3555LE		N/A	25 W / 2.5 GHz	N/A	3.2 GHz	550 MHz	1000 MHz		2012-06-03	$360
			3540M			35 W / 3.0 GHz		3.7 GHz	650 MHz	1300 MHz		2013-01-20	$346
			3525M			35 W / 2.9 GHz		3.6 GHz		1350 MHz		Q3 2012
			3520M			35 W / 2.9 GHz		3.6 GHz		1250 MHz		2012-06-03	$346
			3517U		14 W / ? GHz	17 W / 1.9 GHz	25 W / 2.8 GHz	3.0 GHz	350 MHz	1150 MHz			$346
			3517UE		14 W / ? GHz	17 W / 1.7 GHz	25 W / 2.6 GHz	2.8 GHz	350 MHz	1000 MHz			$330
		Core i5	3610ME		N/A	35 W / 2.7 GHz	N/A	3.3 GHz	650 MHz	950 MHz	3 MB		$276
			3439Y	7 W / ? GHz	10 W / ? GHz	13 W / 1.5 GHz	N/A	2.3 GHz	350 MHz	850 MHz		2013-01-07	$250
			3437U'	N/A	14 W / ? GHz	17 W / 1.9 GHz	25 W / 2.4 GHz	2.9 GHz	650 MHz	1200 MHz		2013-01-20	$225
			3427U		14 W / ? GHz	17 W / 1.8 GHz	25 W / 2.3 GHz	2.8 GHz	350 MHz	1150 MHz		2012-06-03	$225
			3380M		N/A	35 W / 2.9 GHz	N/A	3.6 GHz	650 MHz	1250 MHz		2013-01-20	$266
			3365M			35 W / 2.8 GHz		3.5 GHz		1350 MHz		Q3 2012
			3360M			35 W / 2.8 GHz		3.5 GHz		1200 MHz		2012-06-03	$266
			3340M			35 W / 2.7 GHz		3.4 GHz		1250 MHz		2013-01-20	$225
			3339Y	7 W / ? GHz	10 W / ? GHz	13 W / 1.5 GHz		2.0 GHz	350 MHz	850 MHz		2013-01-07	$250
			3337U	N/A	14 W / ? GHz	17 W / 1.8 GHz		2.7 GHz	350 MHz	1100 MHz		2013-01-20	$225
			3320M		N/A	35 W / 2.6 GHz		3.3 GHz	650 MHz	1200 MHz		2012-06-03
			3317U		14 W / ? GHz	17 W / 1.7 GHz		2.6 GHz	350 MHz	1050 MHz		2012-06-03
			3230M		N/A	35 W / 2.6 GHz		3.2 GHz	650 MHz	1100 MHz		2013-01-20
			3210M		N/A	35 W / 2.5 GHz		3.1 GHz	650 MHz	1100 MHz		2012-06-03
		Core i3	3229Y	7 W / ? GHz	10 W / ? GHz	13 W / 1.4 GHz		N/A	350 MHz	850 MHz		2013-01-07	$250
			3227U	N/A	14 W / ? GHz	17 W / 1.9 GHz				1100 MHz		2013-01-20	$225
			3217U		14 W / ? GHz	17 W / 1.8 GHz				1050 MHz		2012-06-24	$225
			3217UE		14 W / ? GHz	17 W / 1.6 GHz				900 MHz		July 2013	$261
			3130M		N/A	35 W / 2.6 GHz			650 MHz	1100 MHz		2013-01-20	$225
			3120M			35 W / 2.5 GHz				1100 MHz		2012-09-30
			3120ME			35 W / 2.4 GHz				900 MHz		July 2013
			3110M			35 W / 2.4 GHz				1000 MHz		2012-06-24
	2 (2)	Pentium	2030M			35 W / 2.5 GHz				1100 MHz	2 MB	2013-01-20	$134
			2020M			35 W / 2.4 GHz						2012-09-30
			2127U			17 W / 1.9 GHz			350 MHz			2013-06-09
			2117U			17 W / 1.8 GHz				1000 MHz		2012-09-30
			2129Y	7 W		10 W / 1.1 GHz				850 MHz		2013-01-07	$150
		Celeron	1019Y	7 W		10 W / 1.0 GHz				800 MHz		2013-04	$153
			1020E	N/A		35 W / 2.2 GHz			650 MHz	1000 MHz		2013-01-20	$86
			1020M			35 W / 2.1 GHz						2013-01-20
			1005M			35 W / 1.9 GHz						2013-06-09
			1000M			35 W / 1.8 GHz						2013-01-20
			1037U			17 W / 1.8 GHz			350 MHz			2013-01-20
			1017U			17 W / 1.6 GHz						2013-06-09
			1007U			17 W / 1.5 GHz						2013-01-20
			1047UE			17 W / 1.4 GHz				900 MHz			$134
	1 (1)		927UE			17 W / 1.5 GHz				900 MHz			$107

M - Mobile processor
Q - Quad-core
U - Ultra-low power
X - 'Extreme'
Y - Extreme-ultra low power

Roadmap[edit]

Intel demonstrated the Haswell architecture in September 2011, which began release in 2013 as the successor to Sandy Bridge and Ivy Bridge.^[47]

Intel CPU core roadmaps from NetBurst and P6 to Cannonlake

Haswell (microarchitecture)

From Wikipedia, the free encyclopedia

Haswell
L1 cache	64 KB per core
L2 cache	256 KB per core
L3 cache	2 MB to 8 MB shared
GPU	HD Graphics 4200, 4400, 4600, 5000, Iris 5100 or Iris Pro 5200 200 MHz to 1.3 GHz
Predecessor	Sandy Bridge (tock) Ivy Bridge (tick)
Successor	Broadwell (tick) Skylake (tock)
Socket(s)	LGA 1150 rPGA 947 BGA-1364

Haswell is the codename for a processor microarchitecture developed by Intel as the successor to the Ivy Bridge architecture.^[1] It uses the 22 nm process.^[2] Intel officially announced CPUs with this microarchitecture on June 4, 2013 at Computex Taipei 2013.^[3] With Haswell, Intel introduced a low-power processor designed for convertible or 'hybrid' Ultrabooks, having the Y suffix. Intel demonstrated a working Haswell chip at the 2011 Intel Developer Forum.^[4]

Haswell CPUs are used in conjunction with the Intel 8 Series chipsets.

[hide]

Design[edit]

A Haswell wafer with a pin for scale.

The Haswell architecture is specifically designed^[5] to optimize the power savings and performance benefits from the move to FinFET (non-planar, "3D") transistors on the improved 22 nm process node.^[6]

Haswell has been launched in three major forms:^[7]

Desktop version (LGA1150 socket): Haswell-DT
Mobile/Laptop version (PGA socket): Haswell-MB
BGA version:
- 47 W and 57 W TDP classes: Haswell-H (For "All-in-one" systems, Mini-ITX form factor motherboards, and other small footprint formats.)
- 13.5 W and 15 W TDP classes (MCP): Haswell-ULT (For Intel's UltraBook platform.)
- 10 W TDP class (SoC): Haswell-ULX (For tablets and certain UltraBook-class implementations.)

Notes[edit]

ULT = Ultra Low TDP; ULX = Ultra Low eXtreme TDP.
Only certain quad-core variants and BGA R-series SKUs will receive GT3 (Intel HD 5000, Intel Iris 5100), or GT3e (Intel Iris Pro 5200) integrated graphics. All other models will get GT2 (Intel HD 4X00) integrated graphics.^[8] See also Intel HD Graphics for more detailed specifications.
Due to low power requirements of tablet and UltraBook platforms, Haswell-ULT and Haswell-ULX will only be available in dual-core. All other versions will be available in dual- or quad-core variants.

Performance[edit]

Compared to Ivy Bridge:

Approximately 8% better vector processing performance.^[9]
Up to 6% faster single-threaded performance.
6% faster multi-threaded performance.
Desktop variants of Haswell draw between 8% and 23% more power under load than Ivy Bridge.^[9]^[10]^[11]
A 6% increase in sequential CPU performance (eight execution ports per core versus six).^[9]
Up to 20% performance increase over the integrated HD4000 GPU (Haswell HD4600 vs Ivy Bridge's built-in Intel HD4000).^[9]
Total performance improvement on average is about 3%.^[9]
Around 15 °C hotter than Ivy Bridge and unable to break 4.2 GHz easily.^[12]^[13]^[14]^[15]^[16]^[17]

Technology[edit]

Features carried over from Ivy Bridge[edit]

A 22 nm manufacturing process.
3D tri-gate transistors.
Micro-operation cache capable of storing 1.5 K micro-operations (approximately 6 KB in size).^[18]
A 14- to 19-stage instruction pipeline, depending on the micro-operation cache hit or miss (has been working that way since the introduction of Sandy Bridge CPUs).^[18]
Mainstream variants are up to quad-core.^[19]
Native support for dual-channel DDR3 memory,^[20] with up to 32 GB of RAM on LGA 1150 variants.
64 KB (32 KB Instruction + 32 KB Data) L1 cache and 256 KB L2 cache per core.^[21]
A total of 16 PCI Express 3.0 lanes.

New features[edit]

Wider Core: fourth ALU, third AGU, second branch prediction unit, deeper buffers, higher cache bandwidth, improved front-end and memory controller
Haswell New Instructions^[22] (HNI, includes Advanced Vector Extensions 2 (AVX2), gather, BMI1+BMI2, LZCNT and FMA3 support).^[23]
The instruction decode queue, which holds instructions after they have been decoded, is no longer statically partitioned between the two threads that each core can service.^[18]
New sockets – LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market.^[24]
Z97 (performance) and H97 (mainstream) chipsets for the Haswell Refresh and Broadwell, in Q2 2014.^[25]
New socket – LGA 2011-3 with X99 chipset for the Enthusiast-Class Desktop Platform Haswell-E.^[26]
Intel Transactional Synchronization Extensions (TSX), on selected models.^[27]
Graphics support in hardware for Direct3D 11.1 and OpenGL 4.0.^[28]
DDR4 for the enterprise/server variant (Haswell-EX).^[29]
DDR4 for the Enthusiast-Class Desktop Platform Haswell-E.^[30]
Variable Base clock (BClk)^[31] like LGA 2011.^[32]
There are four versions of the integrated GPU: GT1, GT2, GT3 and GT3e, where GT3 version has 40 execution units (EUs). Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs. GT3e version with 40 EUs and on-package 128 MB of embedded DRAM (eDRAM), called Crystal Well, is available only in mobile H-SKUs and desktop (BGA-only) R-SKUs. Effectively, this eDRAM is a Level 4 cache — shared dynamically between the on-die GPU and CPU, and serving as a victim cache to the CPU's L3 cache.^[33]^[34]^[35]^[36]^[37]
Support for Thunderbolt technology and Thunderbolt 2.0.^[38]
Fully integrated voltage regulator (FIVR), thereby moving some of the components from motherboard onto the CPU.^[39]^[40]^[41] FIVR is implemented as a separate 13x8 mm on-package die, manufactured in90 nm process.^[42]
New advanced power-saving system.
37, 47, 57 W thermal design power (TDP) mobile processors.^[19]
35, 45, 65, 84, 95 and 130–140 W (high-end, Haswell-E) TDP desktop processors.^[19]
15 W TDP processors for the Ultrabook platform (multi-chip package like Westmere)^[43] leading to reduced heat which results in thinner as well as lighter Ultrabooks, but performance level will be lower than the 17 W version.^[44]
Shrink of the Platform Controller Hub (PCH), from 65 nm to 32 nm.^[45]

Translation lookaside buffersizes^[46]^[47]
Cache		Page Size
Name	Level	4 KB	2 MB	1 GB
DTLB	1st	64	32	4
ITLB	1st	128	8 / logical core	none
STLB	2nd	1024		none

Expected Server features[edit]

Release not before end of 2014.
Haswell-EP having up to 14–15 cores, and Haswell-EX with up to 18–20 cores.
A new cache design.
Up to 35 MB total unified cache (Last Level Cache (LLC)) for Haswell-EP^[48]^[49] and up to 40 MB for Haswell-EX.
It is possible that Socket R3 will replace LGA 2011 for server Haswells.^[50]^[51]

List of Haswell processors[edit]

Desktop processors[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, F16C, BMI1 (Bit Manipulation Instructions1)+BMI2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bitimplementation), Intel VT-x, and Smart Cache.
- Core i3, i5, i7 support AVX and AES-NI.^[52]
- Core i5 and i7 support AVX2, FMA3 and Turbo Boost 2.0.^[52]
- Core i3 and i7 support Hyper-threading (HT). The dual-core Core i5 4570T also supports HT.^[52]
- Parts below 45xx as well as R and K parts do not support TSX, Trusted Execution Technology, or vPro.^[52]
- Intel VT-d is supported on i5 and i7 except K models.^[52]
Transistors: 1.4 billion
Die size: 177 mm²

Intel HD Graphics in following variants:
- R-series desktop processors feature Intel Iris Pro 5200 graphics (GT3e).^[53]
- All other currently known i3, i5 and i7 desktop processors include Intel HD 4600 graphics (GT2).^[54]
- The exceptions are processors 4130 and 4130T, which include HD 4400 graphics (GT2).
- Pentium processors contain Intel HD Graphics (GT1).

Haswell-based desktop Celerons are planned for the first quarter of 2014.^[55]

List of announced desktop processors is as follows:

Target segment	Cores (Threads)	Processor Branding & Model		CPU Clock rate		Graphics Clock rate		L3 Cache	GPU eDRAM	TDP	Release Date	Release price (USD)	Motherboard
Target segment	Cores (Threads)	Processor Branding & Model		Normal	Turbo	Normal	Turbo	L3 Cache	GPU eDRAM	TDP	Release Date	Release price (USD)	Socket	Interface	Memory
Performance	4 (8)	Core i7	4771	3.5 GHz	3.9 GHz	350 MHz^[56]	1.2 GHz	8 MB	N/A	84 W	September 1, 2013	$320	LGA 1150	DMI 2.0 PCIe 3.0^∗	Up to dual channel DDR3-1600^[57]
			4770K	3.5 GHz			1.25 GHz				June 2, 2013^[58]	$339
			4770	3.4 GHz			1.2 GHz					$303
			4770S	3.1 GHz			1.2 GHz			65 W		$303
			4770R	3.2 GHz		200 MHz	1.3 GHz	6 MB	128 MB	65 W		$	BGA
			4770T	2.5 GHz	3.7 GHz	350 MHz^[56]	1.2 GHz	8 MB	N/A	45 W		$303	LGA 1150
			4765T	2.0 GHz	3.0 GHz			8 MB		35 W		$303
Mainstream	4 (4)	Core i5	4670K	3.4 GHz	3.8 GHz			6 MB		84 W		$242
			4670	3.4 GHz						84 W		$213
			4670S	3.1 GHz						65 W		$213
			4670R	3.0 GHz	3.7 GHz	200 MHz	1.3 GHz	4 MB	128 MB	65 W		$	BGA
			4670T	2.3 GHz	3.3 GHz	350 MHz^[56]	1.2 GHz	6 MB	N/A	45 W		$213	LGA 1150
			4570	3.2 GHz	3.6 GHz		1.15 GHz			84 W		$192
			4570S	2.9 GHz	3.6 GHz					65 W		$192
			4570R	2.7 GHz	3.2 GHz	200 MHz		4 MB	128 MB	65 W		$	BGA
	2 (4)		4570T	2.9 GHz	3.6 GHz	200 MHz		4 MB	N/A	35 W		$192	LGA 1150
	4 (4)		4440	3.1 GHz	3.3 GHz	350 MHz^[56]	1.1 GHz	6 MB		84 W	September 1, 2013	$187
			4440S	2.8 GHz	3.3 GHz					65 W	September 1, 2013	$187
			4430	3.0 GHz	3.2 GHz					84 W	June 2, 2013^[58]	$182
			4430S	2.7 GHz	3.2 GHz					65 W	June 2, 2013^[58]	$182
	2 (4)	Core i3	4340	3.6 GHz	N/A		1.15 GHz	4 MB		54 W	September 1, 2013	$157
			4330	3.5 GHz						54 W		$147
			4330T	3.0 GHz		200 MHz				35 W		$138
			4330TE	2.4 GHz		350 MHz	1 GHz			35 W		$122
			4130	3.4 GHz		350 MHz	1.15 GHz	3 MB		54 W		$129
			4130T	2.9 GHz		200 MHz	1.15 GHz			35 W		$131
	2 (2)	Pentium	G3430	3.3 GHz		350 MHz	1.1 GHz			54 W		$93
			G3420	3.2 GHz		350 MHz	1.15 GHz			54 W		$82
			G3420T	2.7 GHz		200 MHz	1.1 GHz			35 W		$
			G3320TE	2.3 GHz		350 MHz	1 GHz			35 W		$70
			G3220	3.0 GHz		350 MHz	1.1 GHz			54 W		$64			Up to dual channel DDR3-1333
			G3220T	2.6 GHz		200 MHz	1.1 GHz			35 W		$64			Up to dual channel DDR3-1333

^∗ Requires a compatible motherboard

Suffixes to denote:

K - Unlocked (adjustable CPU multiplier up to 63x)
S - Performance-optimized lifestyle (low power with 65 W TDP)
T - Power-optimized lifestyle (ultra low power with 35–45 W TDP)
R - BGA packaging / High performance GPU (currently Iris Pro 5200 (GT3e))

Server processors[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX (Advanced Vector Extensions), AVX2, FMA3, F16C, BMI (Bit Manipulation Instructions 1)+BMI2, Enhanced Intel SpeedStepTechnology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel vPro, Intel VT-x, Intel VT-d, Hyper-threading (except E3-1220 v3 and E3-1225 v3), Turbo Boost 2.0, AES-NI, Smart Cache, andTSX.

List of announced server processors as follows:

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	CPU Clock rate		Graphics Clock rate		L3 Cache	TDP	Release Date	Release price (USD) tray / box	Motherboard
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	Normal	Turbo	Normal	Turbo	L3 Cache	TDP	Release Date	Release price (USD) tray / box	Socket	Interface	Memory
Server	4 (8)	Xeon E3	1285v3	HD P4600 (GT2)	3.6 GHz	4.0 GHz	350 MHz	1.3 GHz	8 MB	84 W	June 2, 2013	$662 / —	LGA 1150	DMI 2.0 PCIe 3.0^∗	up to dual channel DDR3-1600 w/ ECC
			1285Lv3	HD P4600 (GT2)	3.1 GHz	3.9 GHz	350 MHz	1.25 GHz		65 W		$774 / —
			1280v3	N/A	3.6 GHz	4.0 GHz	N/A			82 W		$612 / —
			1275v3	HD P4600 (GT2)	3.5 GHz	3.9 GHz	350 MHz	1.25 GHz		84 W		$339 / $350
			1270v3	N/A	3.5 GHz	3.9 GHz	N/A			80 W		$328 / —
			1268Lv3	HD P4600 (GT2)	2.3 GHz	3.3 GHz	350 MHz	1 GHz		45 W		$310 / —
			1265Lv3	HD (GT1)	2.5 GHz	3.7 GHz		1.2 GHz		45 W		$294 / —
			1245v3	HD P4600 (GT2)	3.4 GHz	3.8 GHz		1.2 GHz		84 W		$276 / $287
			1240v3	N/A	3.4 GHz	3.8 GHz	N/A			80 W		$262 / $273
			1230v3		3.3 GHz	3.7 GHz				80 W		$240 / $250
			1230Lv3		1.8 GHz	2.8 GHz				25 W		$250 / —
	4 (4)		1225v3	HD P4600 (GT2)	3.2 GHz	3.6 GHz	350 MHz	1.2 GHz		84 W		$213 / $224
	4 (4)		1220v3	N/A	3.1 GHz	3.5 GHz	N/A			80 W		$193 / —
	2 (4)		1220Lv3	N/A	1.1 GHz	1.3 GHz	N/A		4 MB	13 W	September 1, 2013	$193 / —

^∗ Requires a compatible motherboard

Suffixes to denote:

L - Low power

Mobile processors[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, BMI1 (Bit Manipulation Instructions1), BMI2, Enhanced Intel SpeedStep Technology (EIST), Intel VT-x, Intel 64, XD bit (an NX bit implementation), Turbo Boost 2.0, AES-NI, and Smart Cache.
Platform Controller Hub (PCH) integrated into the CPU package, slightly reducing the amount of space used on motherboards.^[59]

List of announced mobile processors as follows:

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	Programmable TDP^[60]				CPU Turbo	Graphics Clock rate		L3 Cache	GPU eDRAM	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	SDP^[61]	cTDP down	Nominal TDP	cTDP up	1-core	Normal	Turbo	L3 Cache	GPU eDRAM	Release Date	Price (USD)
Performance	4 (8)	Core i7	4930MX	HD 4600 (GT2)	N/A	N/A	57 W / 3.0 GHz	65 W / 3.7 GHz	3.9 GHz	400 MHz	1350 MHz	8 MB	N/A	June 2, 2013^[62]	$1096
			4960HQ	Iris Pro 5200 (GT3e)		N/A	47 W / 2.6 GHz	55 W / 3.6 GHz	3.8 GHz	200 MHz	1300 MHz	6 MB	128 MB^[34]	September 1, 2013^[63]	$657
			4950HQ	Iris Pro 5200 (GT3e)			47 W / 2.4 GHz	55 W / 3.4 GHz	3.6 GHz	200 MHz		6 MB	128 MB^[34]	June 2, 2013^[62]	$657
			4900MQ	HD 4600 (GT2)			47 W / 2.8 GHz	55 W / 3.6 GHz	3.8 GHz	400 MHz		8 MB	N/A	June 2, 2013^[62]	$570
			4860EQ	Iris Pro 5200 (GT3e)			47 W / 1.8 GHz	N/A	3.2 GHz	750 MHz	1000 MHz	6 MB	128 MB	August 2012	$508
			4850EQ				47 W / 1.6 GHz	N/A	3.2 GHz	650 MHz	1000 MHz			August 2012	$466
			4850HQ				47 W / 2.3 GHz	55 W / 3.3 GHz	3.5 GHz	200 MHz	1300 MHz			June 2, 2013^[62]	$468
			4800MQ	HD 4600 (GT2)			47 W / 2.7 GHz	55 W / 3.5 GHz	3.7 GHz	400 MHz	1300 MHz		N/A		$380
			4750HQ	Iris Pro 5200 (GT3e)			47 W / 2.0 GHz	55 W / 3.0 GHz	3.2 GHz	200 MHz	1200 MHz		128 MB		$440
			4702MQ	HD 4600 (GT2)			37 W / 2.2 GHz	45 W / 2.9 GHz		400 MHz	1150 MHz		N/A		$383
			4702HQ				37 W / 2.2 GHz	45 W / 2.9 GHz
			4700MQ				47 W / 2.4 GHz	55 W / 3.2 GHz	3.4 GHz
			4700HQ								1200 MHz
			4700EQ								1000 MHz				$378
Mainstream	2 (4)		4650U	HD 5000 (GT3)		11.5 W / 800 MHz	15 W / 1.7 GHz	N/A	3.3 GHz	200 MHz	1100 MHz	4 MB			$454
			4610Y	HD 4200 (GT2)	6 W / 800 MHz	9.5 W / 800 MHz	11.5 W / 1.7 GHz		2.9 GHz	200 MHz	850 MHz			September 1, 2013	N/A
			4600M	HD 4600 (GT2)	N/A	N/A	37 W / 2.9 GHz		3.6 GHz	400 MHz	1300 MHz				$346
			4600U	HD 4400 (GT2)		11.5 W / 800 MHz	15 W / 2.1 GHz		3.3 GHz	200 MHz	1100 MHz				$398
			4558U	Iris 5100 (GT3)		23 W / 800 MHz	28 W / 2.8 GHz		3.3 GHz		1200 MHz			June 2, 2013^[62]	$454
			4550U	HD 5000 (GT3)		11.5 W / 800 MHz	15 W / 1.5 GHz		3.0 GHz		1100 MHz				$454
			4500U	HD 4400 (GT2)		11.5 W / 800 MHz	15 W / 1.8 GHz	25 W / ?	3.0 GHz		1100 MHz				$398
		Core i5	4402E	HD 4600 (GT2)		N/A	25 W / 1.6 GHz	N/A	2.7 GHz	400 MHz	900 MHz	3 MB		September 1, 2013	$266
			4400E	HD 4600 (GT2)		N/A	37 W / 2.7 GHz		3.3 GHz	400 MHz	1000 MHz			September 1, 2013	$266
			4350U	HD 5000 (GT3)		11.5 W / 800 MHz	15 W / 1.4 GHz		2.9 GHz	200 MHz	1100 MHz			June 2, 2013^[62]	$342
			4330M	HD 4600 (GT2)		N/A	37 W / 2.8 GHz		3.5 GHz	400 MHz	1250 MHz			September 1, 2013	$266
			4302Y	HD 4200 (GT2)	4.5 W / 800 MHz	N/A	11.5 W / 1.6 GHz		2.3 GHz	200 MHz	850 MHz				N/A
			4300Y	HD 4200 (GT2)	6 W / 800 MHz	9.5 W / 800 MHz	11.5 W / 1.6 GHz		2.3 GHz	200 MHz	850 MHz				$304
			4300M	HD 4600 (GT2)	N/A	N/A	37 W / 2.6 GHz		3.3 GHz	400 MHz	1250 MHz				$225
			4300U	HD 4400 (GT2)		11.5 W / 800 MHz	15 W / 1.9 GHz		2.9 GHz	200 MHz	1100 MHz				$287
			4288U	Iris 5100 (GT3)		23 W / 800 MHz	28 W / 2.6 GHz		3.1 GHz		1200 MHz			June 2, 2013^[62]	$342
			4258U	Iris 5100 (GT3)		23 W / 800 MHz	28 W / 2.4 GHz		2.9 GHz		1100 MHz
			4250U	HD 5000 (GT3)		11.5 W / 800 MHz	15 W / 1.3 GHz		2.6 GHz		1000 MHz
			4210Y	HD 4200 (GT2)	6 W / 800 MHz	9.5 W / 800 MHz	11.5 W / 1.5 GHz		1.9 GHz		850 MHz			September 1, 2013	$304
			4202Y		4.5 W / 800 MHz	N/A	11.5 W / 1.6 GHz		2.0 GHz					September 1, 2013	N/A
			4200Y		6 W / 800 MHz	9.5 W / 800 MHz	11.5 W / 1.4 GHz		1.9 GHz					June 2, 2013^[62]	$304
			4200U	HD 4400 (GT2)	N/A	11.5 W / 800 MHz	15 W / 1.6 GHz	25 W / ?	2.6 GHz		1000 MHz			June 2, 2013^[62]	$287
			4200H	HD 4600 (GT2)		N/A	47 W / 2.8 GHz	N/A	3.4 GHz	400 MHz	1150 MHz			September 1, 2013	$257
			4200M	HD 4600 (GT2)		N/A	37 W / 2.5 GHz		3.1 GHz	400 MHz	1150 MHz			September 1, 2013	$240
		Core i3	4158U	Iris 5100 (GT3)		23 W / 800 MHz	28 W / 2.0 GHz		N/A	200 MHz	1100 MHz			June 2, 2013^[62]	$342
			4102E	HD 4600 (GT2)		N/A	25 W / 1.6 GHz			400 MHz	900 MHz			September 1, 2013	$225
			4100E			N/A	37 W / 2.4 GHz				900 MHz				$225
			4100M			N/A	37 W / 2.5 GHz				1100 MHz				N/A
			4100U	HD 4400 (GT2)		11.5 W / 800 MHz	15 W / 1.8 GHz			200 MHz	1000 MHz			June 2, 2013^[62]	$287
			4020Y	HD 4200 (GT2)	6 W / 800 MHz	9.5 W / 800 MHz	11.5 W / 1.5 GHz				850 MHz			September 1, 2013	$304
			4012Y		4.5 W / 800 MHz	N/A	11.5 W / 1.5 GHz							September 1, 2013	N/A
			4010Y		6 W / 800 MHz	9.5 W / 800 MHz	11.5 W / 1.3 GHz							June 2, 2013^[62]	$304
			4010U	HD 4400 (GT2)	N/A	11.5 W / 800 MHz	15 W / 1.7 GHz				1000 MHz			June 2, 2013^[62]	$287
			4005U	HD 4400 (GT2)		11.5 W / 800 MHz	15 W / 1.7 GHz				950 MHz			September 1, 2013	$281
			4000M	HD 4600 (GT2)		N/A	37 W / 2.4 GHz			400 MHz	1100 MHz				$240
	2 (2)	Pentium	3560Y	HD Graphics	6 W / 800 MHz	N/A	11.5 W / 1.2 GHz			200 MHz	850 MHz	2 MB			N/A
			3556U		N/A		15 W / 1.7 GHz			200 MHz	1000 MHz
			3550M				37 W / 2.3 GHz			400 MHz	1100 MHz
		Celeron	2980U				15 W / 1.6 GHz			200 MHz	1000 MHz				$137
			2955U				15 W / 1.4 GHz			200 MHz	1000 MHz				$132
			2950M				37 W / 2.0 GHz			400 MHz	1100 MHz				$86

Suffixes to denote:

M - Mobile processor
Q - Quad-core
U - Ultra-low power
X - 'Extreme'
Y - Extreme-low power
H - BGA1364 packaging

Roadmap[edit]

The main article for this category is Intel Tick-Tock.

The Skylake microarchitecture will be the successor to the Haswell and Broadwell architectures.

Intel CPU core roadmaps from NetBurst and P6 to Cannonlake

Broadwell (microarchitecture)

From Wikipedia, the free encyclopedia

Broadwell
Predecessor	Haswell
Successor	Skylake

Broadwell is Intel's codename for the second processor in its Haswell microarchitecture. In keeping with Intel's tick-tock principle, Broadwell is the next step in semiconductor fabrication, with feature size reduced to 14 nanometers.^[1]^[2]

Broadwell will adopt the Multi-Chip Package (MCP) design. The new layout might be also moving the integrated voltage regulator (IVR) off-die and back onto the motherboards, in an attempt to reduce CPU's heat production.^[3]

Broadwell will be used in conjunction with Intel 9 Series chipsets.^[4]

[hide]

Expected variants[edit]

Broadwell is expected to launch in three major forms:^[5]

Broadwell-D: desktop version (LGA 1150 socket)
BGA version:
- Broadwell-H: 35 W and 55 W TDP classes, for "all-in-one" systems, Mini-ITX form factor motherboards, and other small footprint formats
- Broadwell-U: less than 15 W TDP class (SoC), for Intel's ultrabook and NUC platforms
- Broadwell-Y: less than 10 W TDP class (SoC), for tablets and certain ultrabook-class implementations
Broadwell-M: mobile/laptop version (PGA socket).

Instruction set extensions[edit]

Broadwell will introduce some instruction set architecture extensions:^[6]^[7]

ADOX/ADCX/MULX for improving performance of arbitrary-precision integer operations^[8]
RDSEED to generate 16-, 32- or 64-bit random numbers according to NIST SP 800-90B and 800-90C^[9]
PREFETCHW instruction^[9]

Roadmap[edit]

Main article: Intel Tick-Tock

On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013.^[10]

On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This will coincide with the release of Intel's 9-series chipset, which may be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket.^[11]^[12]

No new mobile roadmaps have yet leaked to clarify if mobile Broadwell will be available in 2014. A leaked slide shows Broadwell-E/EP/EX in 2015.^[13]

http://en.wikipedia.org/wiki/Skylake_(microarchitecture)

Skylake (microarchitecture)

From Wikipedia, the free encyclopedia

Skylake
Predecessor	Haswell (tock) Broadwell (tick)
Successor	Cannonlake (tick)

Skylake is the codename for a processor microarchitecture to be developed by Intel as the successor to the Haswell architecture.^[1] Skylake will use a 14 nmprocess.^[2]

There are no official details regarding this microarchitecture's development. The first Skylake processors are expected in 2015-2016.^[3]

[hide]

Architecture[edit]

14 nm process.
Mainstream support for DDR4 SDRAM.^[4]^[5]
Support for 20 lanes PCIe3 (LGA 1151)
Support for PCIe 4.0 (Skylake-E/EP/EX).^[6]^[7]
128 KB L1 Cache (64 KB 16 way set associative instruction cache + 64 KB 16 way set associative data cache) (2 cycles)
512 KB L2 cache, 16 way set associative. (6 cycles)
12 MB L3 cache, 24 way set associative (12 cycles)
Quad core default
Support for SATA Express^[6]
AVX-512F: Advanced Vector Extensions 3.2.
Intel SHA Extensions: SHA-1 and SHA-256 (Secure Hash Algorithms).
Intel MPX (Memory Protection Extensions).
Intel ADX (Multi-Precision Add-Carry Instruction Extensions).
LGA 1151
Support for up to 64 GB DDR4 RAM (LGA 1151)

http://en.wikipedia.org/wiki/Cannonlake

Cannonlake

From Wikipedia, the free encyclopedia

Cannonlake
Predecessor	Skylake

In keeping with Intel's tick-tock principle, the 10 nm shrink of Skylake is due out the year after the introduction of the microarchitecture and is rumored to be codenamed "Cannonlake" (sources from 2011 indicated Skymont was to be the codename); however no official announcement has been made. However, Cannonlake is referred to as being in development already, directly from Intel's job listing.^[1] Further nodes are not clear either although latest Intel development (Q3 2012) indicates 7 nm node may reach production around 2017, with 5 nm in 2019.^[2]

In 2009 Intel CEO Paul S. Otellini has been quoted as saying that silicon is in its last decade as the base material of the CPU.^[3]

http://en.wikipedia.org/wiki/Bonnell_(microarchitecture)

Bonnell (microarchitecture)

From Wikipedia, the free encyclopedia

Bonnell
Intel Atom logo
Produced	2008–present
Common manufacturer(s)	Intel
Max. CPU clock rate	600 MHz to 2.13 GHz
FSB speeds	400 MHz to 667 MHz
Instruction set	Intel Atom x86
Cores	1, 2
Successor	Silvermont
Package(s)	441-ball µFCBGA
Core name(s)	Silverthorne Diamondville Pineview Tunnel Creek Lincroft Stellarton Sodaville Cedarview

List of Intel CPU microarchitectures
Microarchitecture	Pipeline stages
P5 (Pentium)	5
P6 (Pentium Pro)	14
P6 (Pentium 3)	10
NetBurst (Willamette)	20
NetBurst (Northwood)	20
NetBurst (Prescott)	31
NetBurst (Cedar Mill)	31
Core	14
Bonnell	16

Bonnell is a CPU microarchitecture used by Intel Atom processors which can execute up to two instructions per cycle.^[1]^[2] Like many other x86 microprocessors, it translates x86 instructions (CISC instructions) into simpler internal operations (sometimes referred to as micro-ops, effectively RISC style instructions) prior to execution. The majority of instructions produce one micro-op when translated, with around 4% of instructions used in typical programs producing multiple micro-ops. The number of instructions that produce more than one micro-op is significantly fewer than the P6 andNetBurst microarchitectures. In the Bonnell microarchitecture, internal micro-ops can contain both a memory load and a memory store in connection with an ALU operation, thus being more similar to the x86 level and more powerful than the micro-ops used in previous designs.^[3] This enables relatively good performance with only two integer ALUs, and without any instruction reordering, speculative execution or register renaming. The Bonnell microarchitecture therefore represents a partial revival of the principles used in earlier Intel designs such as P5 and the i486, with the sole purpose of enhancing the performance per watt ratio. However, Hyper-Threading is implemented in an easy (i.e. low-power) way to employ the whole pipeline efficiently by avoiding the typical single thread dependencies.^[3]

First generation cores[edit]

Silverthorne microprocessor[edit]

On 2 March 2008, Intel announced a new single-core Atom Z5xx series processor (code-named Silverthorne), to be used in ultra-mobile PCs and mobile Internet devices (MIDs), which will supersede Stealey(A100 and A110). The processor has 47 million transistors on a 25 mm² die, allowing for extremely economical production (~2500 chips on a single 300 mm diameter wafer).

An Atom Z500 processor's dual-thread performance is equivalent to its predecessor Stealey, but should outperform it on applications that can use simultaneous multithreading and SSE3.^[4] They run from 0.8 to 2.0 GHz and have a TDP rating between 0.65 and 2.4 W that can dip down to 0.01 W when idle.^[5] They feature 32 KB instruction L1 and 24 KB data L1 caches, 512 KB L2 cache and a 533 MT/s front-side bus. The processors are manufactured in 45 nm process.^[6]^[7]

Diamondville microprocessor[edit]

The Intel Atom N270

On 2 March 2008, Intel announced lower-power variants of the Diamondville CPU named Atom N2xx. It was intended for use in nettops and the Classmate PC.^[8]^[9]^[10] Like their predecessors, these are single-core CPUs with Hyper-Threading.

The N270 has a TDP rating of 2.5 W, runs at 1.6 GHz and has a 533 MHz FSB.^[11] The N280 has a clock speed of 1.66 GHz and a 667 MHz FSB.^[12]

On 22 September 2008, Intel announced a new 64-bit dual-core processor (unofficially code-named Dual Diamondville) branded Atom 330, to be used in desktop computers. It runs at 1.6 GHz and has a FSB speed of 533 MHz and a TDP rating of 8 W. Its dual core consists of two Diamondville dies on a single substrate.^[13]

During 2009, Nvidia used the Atom 300 and their GeForce 9400M chipset on a mini-ITX form factor motherboard for their Ion platform.

First generation power requirements[edit]

The relatively low power Atom CPU was originally used with a cheaper, not so electricity-efficient chipset such as the Intel 945G

Although the Atom processor itself is relatively low-power for an x86 microprocessor, many chipsets commonly used with it dissipate significantly more power. For example, while the Atom N270 commonly used in netbooks through mid-2010 has a TDP rating of 2.5 W, an Intel Atom platform that uses the 945GSE Express chipset has a specified maximum TDP of 11.8 W, with the processor responsible for a relatively small portion of the total power dissipated. Individual figures are 2.5 W for the N270 processor, 6 W for the 945GSE chipset and 3.3 W for the 82801GBM I/O controller.^[14]^[11]^[15]^[16] Intel also provides a US15W System Controller Hub-based chipset with a combined TDP of less than 5 W together with the Atom Z5xx (Silverthorne) series processors, to be used in ultra-mobile PCs and MIDs,^[17] though some manufacturers have released ultra-thin systems running these processors (e.g. Sony VAIO X).

Initially, all Atom motherboards on the consumer market featured the Intel 945GC chipset, which uses 22 watts by itself. As of early 2009, only a few manufacturers are offering lower-power motherboards with a 945GSE or US15W chipset and an Atom N270, N280 or Z5xx series CPU.

Second generation cores[edit]

Pineview microprocessor[edit]

New Intel Atom N450 SLBMG 1.66GHz 512kB L2 BGA559

On 21 December 2009, Intel announced the N450, D510 and D410 CPUs with integrated graphics.^[18] The new manufacturing process resulted in a 20% reduction in power consumption and a 60% smaller die size.^[19]^[20] The Intel GMA 3150, a 45 nm shrink of the GMA 3100 with no HD capabilities, is included as the on-die GPU. Netbooks using this new processor were released on 11 January 2010.^[19]^[21] The major new feature is longer battery life (10 or more hours for 6-cell systems).^[22]^[23]

This generation of the Atom was codenamed Pineview, which is used in the Pine Trail platform. Intel's Pine Trail-M platform utilizes an Atom processor (codenamed Pineview-M) and Platform Controller Hub (codenamed Tiger Point). The graphics and memory controller have moved into the processor, which is paired with the Tiger Point PCH. This creates a more power-efficient 2-chip platform rather than the 3-chip one used with previous-generation Atom chipsets.^[24]

On 1 March 2010 Intel introduced the N470 processor,^[25] running at 1.83 GHz with a 667 MHz FSB and a TDP rating of 6.5 W.^[26]

The new Atom N4xx chips became available on 11 January 2010.^[27] It is used in netbook and nettop systems and includes an integrated single-channel DDR2memory controller and an integrated graphics core. It also features Hyper-Threading and is manufactured on a 45 nm process.^[28] The new design uses half the power of the older Menlow platform. This reduced overall power consumption and size makes the platform more desirable for use in smartphones and other mobile internet devices.

The D4xx and D5xx series support the x86-64 bit instruction set and DDR2-800 memory. They are rated for embedded use. The series has an integrated graphics processor built directly into the CPU to help improve performance. The models are targeted at nettops and low-end desktops. They do not support SpeedStep.

The Atom D510 dual-core processor runs at 1.66 GHz, with 1 MB of L2 cache and a TDP rating of 13 W.^[29] The single-core Atom D410 runs at 1.66 GHz, with 512 KB of L2 cache and a TDP rating of 10 W.^[30]

Tunnel Creek microprocessor[edit]

Tunnel Creek is an embedded Atom processor used in the Queens Bay platform with the Topcliff PCH.

Lincroft microprocessor[edit]

The Lincroft (Z6xx) with the Whitney Point PCH is included in the Oak Trail tablet platform. Oak Trail is an Intel Atom platform based on Moorestown. Both platforms include a Lincroft microprocessor, but use two distinct input/output Platform Controller Hubs (I/O-PCH), codenamed Langwell and Whitney Point respectively. Oak Trail was presented on 11 April 2011 and was to be released in May 2011.^{[dated info]}^[31]The Z670 processor, part of the Oak Trail platform, delivers improved video playback, faster Internet browsing and longer battery life, "without sacrificing performance" according to Intel. Oak Trail includes support for 1080p video decoding as well as HDMI. The platform also has improved power efficiency and allows applications to run on various operating systems, including Android, MeeGo and Windows.

Stellarton microprocessor[edit]

Stellarton is a Tunnel Creek CPU with an Altera Field Programmable Gate Array (FPGA).

Sodaville SoC[edit]

Groveland SoC[edit]

Third generation cores[edit]

The 32 nm shrink of Bonnell is called Saltwell.

Cedarview microprocessor[edit]

Intel released their third-generation Cedar Trail platform (consisting of a range of Cedarview processors^[32] and the NM10 southbridge chip) based on 32 nm process technology in the fourth quarter of 2011.^[31]Intel stated that improvements in graphics capabilities, including support for 1080p video, additional display options including HDMI and DisplayPort, and enhancements in power consumption are to enable fanless designs with longer battery life.

The Cedar Trail platform includes two new CPUs, 32 nm-based N2800 (1.86 GHz) and N2600 (1.6 GHz), which replace the previous generation Pineview N4xx and N5xx processors. The CPUs also feature an integrated GPU that supports DirectX 9.

In addition to the netbook platform, two new Cedarview CPUs for nettops, D2700 and D3200, were released on 25 September 2011.^[33]

In early March 2012 the N2800-based Intel DN2800MT motherboard^[34] started to become available. Due to the use of a netbook processor, this Mini-ITX motherboard can reach idle power consumption as low as 7.1 W.^[35]

Penwell SoC[edit]

Penwell is an Atom SoC that is part of the Medfield MID/Smartphone platform.

Berryville SoC[edit]

Cloverview SoC[edit]

Cloverview is an Atom SoC that is part of the Clover Trail tablet platform.

Centerton SoC[edit]

In December 2012 Intel launched the 64-bit Centerton family of Atom CPUs, designed specifically for use in Bordenville platform servers.^[36] Based on the 32 nm Saltwell architecture, Centerton adds features previously unavailable in most Atom processors, such as Intel VT virtualization technology, and support for ECC memory.^[37]

Briarwood SoC[edit]

Briarwood is an Atom SoC that is designed for a server platform.

Roadmap[edit]

The main article for this category is Intel Tick-Tock.

http://en.wikipedia.org/wiki/Silvermont

Silvermont

From Wikipedia, the free encyclopedia

Silvermont
Predecessor	Bonnell Saltwell
Successor	Goldmont

Silvermont is a new low power SoC processor microarchitecture from Intel. Silvermont will form the basis for two consumer SoC families; Merrifield intended forsmartphones and Bay Trail aimed at tablets, hybrid devices, netbooks, nettops, and embedded/automotive systems. As well as Avoton SoCs for micro-servers and storage devices; and Rangeley SoCs targeting network and communication infrastructure.^[1]

Silvermont was announced to the media on May 6, 2013 at Intel's headquarters at Santa Clara, California.^[2]^[3] Intel has repeatedly said the first Bay Trail devices will be available during the Holiday 2013 timeframe, while leaked slides show the most recent release window for Bay Trail-T as August 28-September 13, 2013.^[4]Both Avoton and Rangeley were announced as being available in the second half of 2013. The first Merrifield devices are expected in 1H14.^[5]

[hide]

Design[edit]

Silvermont will be the first Atom processor to feature an out-of-order architecture.^[6]

Technology[edit]

List of Silvermont processors[edit]

Desktop processors (Bay Trail-D)[edit]

List of upcoming desktop processors as follows:

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	CPU Turbo	Graphics Clock rate		L3 Cache	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	1-core	Normal	Turbo	L3 Cache	Release Date	Price (USD)
Value	4 (4)	Pentium	J2850	Intel HD Graphics (4 EU)	10W/ 2.4 GHz	N/A	688 MHz	792 MHz	2 MB	3Q13	OEM
	4 (4)	Celeron	J1850		10W/ 2.0 GHz			792 MHz	2 MB		$82
	2 (2)		J1750		10W/ 2.4 GHz			750 MHz	1 MB		OEM
	4 (4)		J1900^[9]		10W/ 2.0 GHz		?	?	2 MB		OEM

Server Processors (Avoton)[edit]

List of upcoming server processors as follows: ^[10]

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	CPU Turbo	Graphics Clock rate		L3 Cache	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	1-core	Normal	Turbo	L3 Cache	Release Date	Price (USD)
Server	8 (8)	Atom	C2750	N/A	20W/ 2.4 GHz	2.6 GHz	N/A	N/A	4MB	3Q13	$171
	8 (8)		C2730		12W/ 1.7 GHz	2.0 GHz			4MB		$150
	4 (4)		C2550		14W/ 2.4 GHz	2.6 GHz			2MB		OEM
	4 (4)		C2530		9W/ 1.7 GHz	2.0 GHz			2MB
	2 (2)		C2350		6W/ 1.7 GHz	2.0 GHz			1MB

Communications Processors (Rangeley)[edit]

List of upcoming communications processors as follows: ^[11]

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	CPU Turbo	Graphics Clock rate		Intel QuickAssist	L3 Cache	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	1-core	Normal	Turbo	Intel QuickAssist	L3 Cache	Release Date	Price (USD)
Communications	8 (8)	Atom	C2758	N/A	20W/ 2.4 GHz	N/A	N/A	N/A	Yes	4MB	3Q13	$171
			C2738		20W/ 2.4 GHz				No			$171
			C2718		18W/ 2.0 GHz				Yes			$150
	4 (4)		C2558		15W/ 2.4 GHz				Yes	2MB		$86
			C2538		15W/ 2.4 GHz				No			$86
			C2518		15W/ 1.7 GHz				Yes			$75
	2 (2)		C2358		7W/ 1.7 GHz	2.0 GHz			Yes	1MB		$49
	2 (2)		C2358		7W/ 1.7 GHz	2.0 GHz			No	1MB		$49

Embedded/automotive processors (Bay Trail-I)[edit]

List of embedded processors as follows: ^[12]

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	CPU Turbo	Graphics Clock rate		L3 Cache	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	1-core	Normal	Turbo	L3 Cache	Release Date	Price (USD)
Embedded	4 (4)	Atom	E3845	Intel HD Graphics (4 EU)	10W/ 1.91 GHz	N/A	542 MHz	792 MHz	2MB	4Q13	$52
	2 (2)		E3827		8W/ 1.75 GHz		542 MHz	792 MHz	1MB		$41
			E3826		7W/ 1.46 GHz		533 MHz	677 MHz			$37
			E3825		6W/ 1.33 GHz		533 MHz	N/A			$34
	1 (1)		E3815		5W/ 1.46 GHz		400 MHz	N/A	512KB		$31

Mobile processors (Bay Trail-M)[edit]

List of upcoming mobile processors as follows:

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	CPU Turbo	Graphics Clock rate		L3 Cache	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	TDP	1-core	Normal	Turbo	L3 Cache	Release Date	Price (USD)
Value	4 (4)	Pentium	N3510	Intel HD Graphics (4 EU)	7.5W/ 2.0 GHz	N/A	750 MHz	N/A	2MB	3Q13	OEM
		Celeron	N2920^[13]		7.5W/ 1.6 GHz		?				OEM
			N2910		7.5W/ 1.6 GHz		756 MHz				$132
	2 (2)		N2810		7.5W/ 2.0 GHz		756 MHz		1MB		OEM
	2 (2)		N2805		4.5W/ 1.46 GHz		667 MHz		1MB		OEM

Tablet processors (Bay Trail-T)[edit]

List of upcoming tablet and hybrid processors as follows:

Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	SDP^[14]	TDP	Max CPU Turbo	GraphicsClock rate		L2 Cache	Memory Standard	Max Memory Bandwidth	Max Memory Supported	Max Display Resolution	Release Date	Price (USD)
Target segment	Cores (Threads)	Processor Branding & Model		GPU Model	SDP^[14]	TDP	Max CPU Turbo	Normal	Turbo	L2 Cache	Memory Standard	Max Memory Bandwidth	Max Memory Supported	Max Display Resolution	Release Date	Price (USD)
Value	4 (4)	Atom	Z3770	Intel HD Graphics (4 EU)	2W/ 1.46 GHz	?	2.39 GHz	311 MHz	667 MHz	2 MB	LPDDR3 1067 Dual Channel	17.1 GB/s	4GB	2560×1600	September 11, 2013	$37.00
			Z3770D		2.2W/ 1.5 GHz		2.41 GHz	313 MHz	688 MHz		DDR3L-RS 1333 Single Channel	10.6 GB/s	2GB	1920×1280		$37.00
			Z3740		2W/ 1.33 GHz		1.86 GHz	311 MHz	667 MHz		LPDDR3 1067 Dual Channel	17.1 GB/s	4GB	2560×1600		$32.00
			Z3740D		2.2W/ 1.33 GHz		1.86 GHz	313 MHz	688 MHz		DDR3L-RS 1333 Single Channel	10.6 GB/s	2 GB	1920×1280		$32.00
	2 (2)		Z3680		?/ 1.33 GHz		2.0 GHz	311 MHz	667 MHz	1 MB	LPDDR3 1067 Single Channel	8.5 GB/s	1 GB	1280×800		?
	2 (2)		Z3680D		?/ 1.33 GHz		2.0 GHz	311 MHz	688 MHz	1 MB	DDR3L-RS 1333 Single Channel	10.6 GB/s	2 GB	1920×1280		?

Smartphone processors (Merrifield)[edit]

Roadmap[edit]

The main article for this category is Intel Tick-Tock.

Airmont is the 14 nm shrink of Silvermont.^[6]

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原文地址：https://www.cnblogs.com/baiyw/p/3430471.html

Intel CPU Microarchitecture

Intel Core (microarchitecture)

Contents

Features[edit]

Roadmap[edit]

Technology[edit]

Processor cores[edit]

Conroe/Merom (65 nm)[edit]

Conroe-L/Merom-L[edit]

Penryn/Wolfdale (45 nm)[edit]

Dunnington[edit]

Steppings[edit]

Steppings using 65 nm process[edit]

Steppings using 45 nm process[edit]

System requirements[edit]

Motherboard compatibility[edit]

Synchronous memory modules[edit]

Chip errata[edit]

Key Terms[edit]

See also[edit]

Penryn (microarchitecture)

Contents

CPU List[edit]

Processor cores[edit]

Steppings using 45 nm process[edit]

Roadmap[edit]

See also[edit]

Nehalem (microarchitecture)

Contents

Technology[edit]

Performance and power improvements[edit]

Variants Overview[edit]

Server and desktop processors[edit]

Mobile processors[edit]

Roadmap[edit]

See also[edit]

Westmere (microarchitecture)

Contents

CPU Variants[edit]

Westmere CPUs[edit]

Server / Desktop Processors[edit]

Mobile Processors[edit]

Roadmap[edit]

See also[edit]

Sandy Bridge

Contents

Technology[edit]

Models and steppings[edit]

Performance[edit]

List of Sandy Bridge processors[edit]

Desktop platform[edit]

Server platform[edit]

Mobile platform[edit]

Cougar Point chipset flaw[edit]

Limitations[edit]

Overclocking[edit]

Chipset[edit]

vPro remote-control (Intel Insider)[edit]

Software development kit[edit]

Roadmap[edit]

See also[edit]

Ivy Bridge (microarchitecture)

Contents

Overview[edit]

Ivy Bridge features and performance[edit]

Benchmark comparisons[edit]

Thermal performance and heat issues[edit]

Models and steppings[edit]

Ivy Bridge-E features[edit]

Models and Steppings[edit]

List of Ivy Bridge and Ivy Bridge-E processors[edit]

Desktop processors[edit]

Server processors[edit]

Mobile processors[edit]

Roadmap[edit]

See also[edit]

Haswell (microarchitecture)

Contents

Design[edit]

Notes[edit]