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  • 高通发布骁龙808六核/810八核64位芯片

    欢迎转载opendevkit文章, 文章原始地址: http://www.opendevkit.com/?e=67

    The Snapdragon 808 processor is a 64-bit enabled, LTE-equipped chipset for premium mobile computing devices. The Snapdragon 808 processor is anticipated to begin sampling in the second half of 2014 and expected to be available in commercial devices by the first half of 2015.

    骁龙808是64位6核心处理器,支持LTE的高端移动设备处理器。808于2014年下半年开始送样。2015年上半年开始量产商用。

    主要区别是810是八核。

    CPU

    Dual-core ARM® Cortex™ A57 and quad-core A53 with 64-bit support

    GPU

    Qualcomm® Adreno™ 418 GPU

    DSP

    Hexagon™ V56 DSP (up to 800MHz)

    Modem

    Integrated 4G LTE Advanced CAT6 World Mode modem, supporting LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO Rev. B, TD-SCDMA and GSM/EDGE

    CAT6 speeds of up to 300 Mbps with support for up to 3x20 MHz carrier aggregation on LTE FDD and LTE TDD

    4th Generation integrated LTE modem, with support for LTE- Broadcast, LTE multimode dual-SIM (DSDS and DSDA) and HD VoLTE with SRVCC

    RF

    4th gen power efficient LTE multimode transceiver with Qualcomm RF360™ Front End solution for world mode bands, lower power and PCB reduction

    USB

    USB 3.0/2.0

    Bluetooth

    BT 4.1

    WiFi

    Qualcomm® VIVE™ 2-stream 802.11n/ac with MU-MIMO

    GPS

    Qualcomm® IZat™ Gen8C

    NFC

    Supported

    Video

    4K playback with H.264 (AVC) and H.265 (HEVC) formats

    4K capture with H.264 format

    DASH supported

    Camera

    Up to 55 MP Dual ISP

    Display

    2560x1600 on-device display concurrent with 4K Ultra HD output to HDTV

    1080p and 4K external displays supported

    Quick Charge

    Qualcomm® Quick Charge™ 2.0 technology

    PMI8994

    Integrated HW

    Voltage In = 9V, up to 3A out

    Supports parallel charging

    Memory/Storage

    LPDDR3 933MHz Dual-channel 32-bit (12.8GBps)/eMMC 5.0 SD 3.0 (UHS-I)

    Process Technology

    20nm


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  • 原文地址:https://www.cnblogs.com/linucos/p/3832283.html
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